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Patent
number
Title of the invention and abstract piece Date of publication of the patent
1 ES2321021T3
RECIPIENTE PAR AREACTIVOS, REACCION EN PORTAOBJETOS Y BANDEJA DE RETENCION Y METODO DE FUNCIONAMIENTO.

Una bandeja de retención de muestras (10) que define una superficie inferior (150) y que comprende: paredes internas (140); una porción de contención de un reactivo que define un hueco para reactivo (30); una porción de contención de una muestra que define una placa (50) que incluye una superficie para reactivo; una porción para flujo de fluido (40, 650) que está configurada para situar el hueco p...

01.06.2009
2 TWI310398B
POLYMERIC COLORANTS HAVING PIGMENT AND DYE COMPONENTS AND CORRESPONDING INK COMPOSITIONS

Colorants having pigment and dye components having improved chroma and good water and lightfastness are disclosed and described. A polymeric colorant can include a pigment having a polymer covalently attached thereto and a dye covalently attached to the polymer. A dispersant can be covalently attached to at least one of the pigment, the polymer, and the dye. By including both a pigment and a dye c...

01.06.2009
3 TWI310399B
No name
01.06.2009
4 TWI310400B
COMPOSITIONS FOR THE FLAME-INHIBITING FINISHING OF FIBER MATERIALS

Aqueous composition, obtained by preparing a mixture of water and guanidine phosphate; adjusting the pH value of the mixture to 4.5-6.5 at 20[deg]C; adding ammonium sulfamate or amidosulfonic acid, or adding a mixture to both products; optionally adjusting the pH value of the received mixture to 4.5-6.5 at 20[deg]C; and adding ammoniumsulfate. Aqueous composition, obtained by (a) preparing a mixtu...

01.06.2009
5 TWI310401B
No name
01.06.2009
6 TWI310402B
No name
01.06.2009
7 TWI310403B
METHOD FOR POST-ETCH AND STRIP RESIDUE REMOVAL ON CORAL FILMS

A method for cleaning a semiconductor wafer is provided which includes plasma etching a feature into a low K dielectric layer having a photoresist mask where the plasma etching generates etch residues. The method also includes ashing the semiconductor wafer to remove the photoresist mask where the ashing generating ashing residues. The method further includes removing the etching residues and the ...

01.06.2009
8 TWI310404B
THERMOTOLERANT RIBONUCLEASE H

Polypeptides having an RNase H activity highly useful in genetic engineering; genes encoding these polypeptides; and a process for genetic engineeringly producing these polypeptides.

01.06.2009
9 TWI310405B
No name
01.06.2009
10 TWI310406B
METHOD FOR DETERMINING NUCLEIC ACID ANALYTES

The invention generally relates to a method and a device for determining nucleic acid analytes. The invention especially relates to the detection of the presence of one such analyte without the conventional use of optically detectable marker substances.

01.06.2009
11 TWI310407B
SPUTTER TARGET MATERIAL AND METHOD OF PRODUCING THE SAME

A sputter target material which is of a sintered material, wherein the sputter target material consists of 0.5 to 50 atomic % in total of at least one metal element (M) selected from the group of Ti, Zr, V, Nb and Cr, and the balance of Mo and unavoidable impurities, and has a microstructure seen at a perpendicular cross section to a sputtering surface, in which microstructure oxide particles exis...

01.06.2009
12 TWI310408B
CADMIUM TIN OXIDE MULTI-LAYER LAMINATE AND ITS PRODUCING METHOD

A cadmium tin oxide (Cd1-xSnxO) multi-layer laminate is disclosed. The laminate comprises: a substrate; and a layer of Cd1-xSnxO which is not an epitaxial structure; wherein, the composition of Sn/(Cd+Sn) is 1~20%. The method for producing the Cd1-xSnxO multi-layer laminate is also described here. The method comprises steps of: (a) providing metal or oxide targets for sputtering films of Cd1-xSnxO...

01.06.2009
13 TWI310409B
SPUTTERING TARGET

A sputtering target which is produced after being gone through a mechanical grinding step, characterized in that, in its first embodiment, micro-cracks having depths and lengths of at least specified values are substantially eliminated when the sputter surface of this target is observed in section, and that, in its second embodiment, the sputter surface of a sputtering target produced after being ...

01.06.2009
14 TWI310410B
No name
01.06.2009
15 TWI310411B
No name

The present invention relates to a method for manufacturing diodes metallic film wherein on an diode wafer or chip area which is intended to form metallic layer forms a metal, metal oxide or alloy substrate which could be used for non-electrolytic plating replacement or reduction of the wet metal processing; then have a certain metal precipitate on the metal substrate by replacement or reduction r...

01.06.2009
16 TWI310412B
No name
01.06.2009
17 TWI310413B
SILICON WAFER AND PROCESS FOR THE HEAT TREATMENT OF A SILICON WAFER

A silicon wafer having no epitaxially deposited layer or layer produced by joining to the silicon wafer, with a nitrogen concentration of 1·1013-8·1014 atoms/cm3, an oxygen concentration of 5.2·1017-7.5·1017 atoms/cm3, a central thickness BMD density of 3·108-2·1010 cm−3, a cumulative length of linear slippages ≰3 cm and a cumulative area of areal slippage regions ≰7 cm2, the front surface having ...

01.06.2009
18 TWI310414B
DNA FALSITY-PROOF FIBER AND MANUFACTURING METHOD THEREOF

A spinning nozzle for producing the synthetic fibers and a method for producing a DNA counterfeit-proof fiber by the spinning nozzle are provided. The spinning nozzle includes a polymer solution inflow passage and a pair of water inflow passages located at the both sides of the polymer solution inflow passage, wherein the polymer solution inflow passage and the water inflow passages are converged ...

01.06.2009
19 TWI310415B
DRUM-TYPE WASHING MACHINE

PROBLEM TO BE SOLVED: To shorten a drying time by increasing a volume of circulating air inside a drum by a blower without sucking water injected inside a dehumidifier. Ž

SOLUTION: At first, the humidifier 20 is provided in the circumferential direction of the back 7a of a water tub 7 across the half length or more of the water tub. Secondly, the humidifier 20 is provided astride the vertical...

01.06.2009
20 TWI310416B
WASHING MACHINE

A washing machine includes a rotary drum, a water tub, a supporting metallic part, a washing machine base, a motor, a controller, and a vibration detecting unit. The vibration detecting unit, inclusive of a differential transformer having a plurality of coils and a magnetic body, is disposed between the supporting metallic part and the washing machine base and detects a vibration of the water tub.

01.06.2009