A chip module has a contact layer made up of several electrically conductive contact elements. The contact elements have a front side with contact areas. A semiconductor chip is disposed above the contact layer. The semiconductor chip has a main area with a number of chip terminals that are electrically connected by means of bonding wires of a maximum mounting length to the back side of the respec...

The present invention is directed to a composition comprising polystyrene or polypropylene with at least 0.05% (w/w) of an additive or wetting agent, the article of manufacture comprised thereof, such as a mold for making contact lenses and the mold assembly containing said mold, and the use of such mold so to minimize defects, such as holes, puddles, chips and tears in the lens.

With an integral, board-like component, in particular for use as a kitchen working surface, comprising a visible side and a rear side, wherein the visible side comprises a layer consisting of a polymer matrix filled with a first, inorganic filler, its specific density being greater than the specific density of the polymer matrix, it is suggested for the production of the boards in a simple manner ...

A multilayered absorbent feminine hygiene product which is configured for releasable attachment to an user's garment has a plurality of absorbent pads. Each of the absorbent pads has an absorbent layer to contain absorbed fluid and a barrier layer to prevent absorbed fluid from leaking completely through the individual pad. The pads are releasably attached along at least a portion of their lateral...

The present invention is aimed to offer a microwave heating apparatus which heats varieties of heating objects without affecting the excellent property, by introducing a means to control the environment surrounding a heating object. For implementing the objective, the heating apparatus comprises a heating cavity for housing an object of heating, a microwave generating means for irradiating microwa...

Multi-layered compositions having a plurality of pillared metal complexes disposed on a supporting substrate, the pillars comprising divalent electron acceptor moieties with a phosphonate or arsenate at each end. Each layer of parallel pillars is separated by a layer of a group (IVA), (IVB), (IIIA) or (IIIB) metal or a lanthanide. The compositions can further comprise particles of at least one Gro...