The invention relates to an integrated stock farming system, comprising at least a stable for keeping cattle, wherein means are present for substantially preventing the formation of ammonia through contact of solid manure and urine by separation into a solid and a liquid phase, which system further comprises means for at least partly reprocessing the solid and/or the liquid phase into useful produ...

A device and method for the treatment of effluent with activated sludge in suspension, for the removal of nitrogen and phosphorus and for simultaneous sludge stabilization. An activated chamber has a fermentation zone, a denitrification zone and a nitrification zone, whereby the fermentation zone and the denitrification zone in the activated chamber, are separated by scum boards and overflow barri...

The invention offers a method and apparatus for solubilizing excess sludge, having a high solubilizing ability, a low total cost, and capable of reducing the size of facilities. The method for reducing excess sludge comprises adding a solubilizing agent to excess sludge generated by microbial treatment of organic sewage, applying ultrasonic waves, applying a reduced pressure swelling step, then re...

A method and system of forming a fire door core. Hydraulic binder and resin are supplied from raw material bins and mixed to provide a submixture. Exfoliated vermiculite is then mixed with the submixture to provide a mixture that is deposited into a plurality of compression molds. Each of the filled molds are pressed in a press at a predetermined temperature at a predetermined pressure for a prede...

The present invention generally provides a method of measuring the biological activity of Coagulation Factor VIIa (Factor VIIa). Specifically, the present invention provides a method for directly measuring the activity of Factor VIIa in a plasma sample. More specifically, the present invention provides a method for utilizing Factor VIIa activity as a bio-marker to monitor Factor VIIa inhibition to...

A semiconductor package is provided. The semiconductor package includes a semiconductor device supported by a substrate. The package also includes a heat spreader having a surface divided into a central area and a channel. The channel is recessed relative to said die area. The package also includes a thermal interface material layer disposed between the semiconductor device and the surface of the ...

A semiconductor device manufacturing method according to the present invention comprising: arranging a dam made of a highly heat-shrinkable material on a surface of a circuit substrate, wherein the dam defines a region including a semiconductor element, a conductor, and part of a conductive pattern connected to one end of the conductor; injecting a sealer into a region defined by the dam and using...

A non-contact data carrier includes a semiconductor device (11), a coil antenna (12), and a sealing resin coating (13) sealing the semiconductor device (11) and the coil antenna (12) therein. The electrodes (11a) of the semiconductor device (11) are connected to the opposite ends (12a, 12b) of the coil antenna (12) by wires (14). The surface of the coil antenna (12) opposite to the sealing resin c...

A method and structure for a memory structure that includes a plurality of substrates stacked one on another is disclosed. The invention includes a plurality of connectors connecting the substrates to one another and a plurality of memory chip packages mounted on the substrates. The connectors have a size sufficient to form a gap between the substrates. The gap is larger than a height of the memor...

A semiconductor package includes a first insulating substrate, a second insulating substrate, and a plurality of semiconductor chip units placed between the first and second insulating substrates. The first insulating substrate has wiring placed on one surface thereof and has first electrically conductive balls which are used as external connection terminals and second electrically conductive ball...

A flip-chip package substrate layout for reducing plan inductance. The flip-chip package substrate includes a plurality of sequentially stacked wiring layers, at least one insulation layer between two neighboring wiring layers so that the insulation layer and the wiring layers are alternately stacked on top of each other, and a plurality of conductive plugs individually penetrating the insulation ...

A resin-sealed semiconductor device which comprises a lead frame having a die bond pad and an inner lead, a semiconductor chip installed on the die bond pad via a die bonding material and a sealing material for sealing the semiconductor chip and the lead frame, wherein properties of the die bonding material and the sealing material after curing satisfies the following formulae: sigmae<=0.2xsigmab ...

A method for fabricating a semiconductor device heat spreader from a unitary piece of metallic material. The metallic material is stamped to form a unitary heat spreader having an upper heat dissipation region, a lower substrate contact region, and supports connecting the upper heat dissipation region and the lower substrate contact region. A recess is formed within the supports and the upper and ...

A semiconductor device includes a plurality of semiconductor chips; and a plurality of substrates, each of the substrates having one of the semiconductor chips mounted thereon. The substrates are stacked each other. The upper and lower ones of the semiconductor chips mounted on a pair of the stacked substrates are electrically connected through first terminals provided in a region outside the regi...

A semiconductor device includes a circuit board, a semiconductor element that is mounted on an upper surface of the circuit board and has an electrode terminal, and a sealing resin for sealing a periphery of the semiconductor element that is mounted on the upper surface of the circuit board. The circuit board includes a plurality of conductive members and an insulating substance for binding and fi...

A method and system for scanning bar code data that can be published in near real time on Internet or intranet sites. The format is preferably XML-based, so the data is ready for e-commerce applications without further manipulation or conversion. The data can also be translated to more traditional bar code formats for backward compatibility with established barcode scanning practices.

An electronic circuit module formed of an antenna coil and an integrated circuit provided on a circuit board is provided inside a hollow resin case formed of a first part and a second part. A first slit leading into the hollow portion is provided in one side face of the resin case formed of the first and second parts joined to each other. Since the electronic circuit module is not exposed to high ...

Method and device for reducing the vibratory motions of the fuselage of an aircraft.According to the invention, accelerometers (9, 10) are mounted on engines (M1, M4) of the aircraft (1) and, with the aid of the accelerometric measurements thus obtained and of the aeroelastic model of said aircraft, control commands (dZ, dY) to be applied to the ailerons (M1 to M4) so as to counteract the oscillat...

An apparatus for positioning and adjusting a light pipe includes a bracket that is formed by folding a metallic plate. When the metallic plate is folded to form the bracket, a first end and a second end of the metallic plate perpendicularly press against each other to form a close space for accommodating the light pipe. The apparatus for positioning and adjusting a light pipe further includes a cl...

A die used for molding an electronic component with resin includes a fixed, top die and a movable, bottom die and at least has a surface contacting a melted resin material that is electroplated with nickel-tungsten alloy. This plating can provide releaseability of a resin-molded body and the like superior to hard-chromium plating to allow an ejector pin to efficiently eject and release the resin-m...