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Patent
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Title of the invention and abstract piece Date of publication of the patent
1 GB2324208A
ELECTRICAL CONNECTOR FOR LOUDSPEAKER CONNECTIONS

An electrical connector comprises a cable plug (1) and a chassis socket (12). The cable plug (1) and the chassis socket (12) each comprise an enclosure (2, 13) with contacts (9, 19) which are preferably planar. The contacts (9) of the cable plug (1) are disposed at facing inner faces (8) of limbs of a U- or frame-shaped part (5) of the enclosure (2). A wedge-shaped holding space (14) for holding t...

14.10.1998
2 EP869744A1
ORTHOPÄDISCHE PROTHESEVORRICHTUNG;AN ORHTOPAEDIC PROSTHETIC DEVICE;PROTHESE ORTHOPEDIQUE

An orthopaedic prosthetic device (11) applicable to pairs of bone stumps, proximal and distal, of a skeletal segment (12) in which a complete fracture or surgery was followed by a loss of bone material, defining a distance (D) between the respective opposite heads (1a, 2a) of the stumps, the device (11) comprising a tube (3) made of biocompatible, bioresorbable material, may be fitted between the ...

14.10.1998
3 EP869920A1
METHODE UND EINRICHTUNG FÜR DIE REINIGUNG VON ABWASSER NACH DER BELEBTSCHLAMM-METHODE;METHOD AND PLANT FOR THE PURIFICATION OF WASTE WATER BY THE ACTIVATED SLUDGE METHOD;PROCEDE ET APPAREIL DE PURIFICATION DES EAUX USEES PAR LA METHODE DES BOUES ACTIVEES

PCT No. PCT/DK95/00309 Sec. 371 Date Mar. 12, 1997 Sec. 102(e) Date Mar. 12, 1997 PCT Filed Jul. 14, 1995 PCT Pub. No. WO96/02468 PCT Pub. Date Feb. 1, 1996A method and plant for the purification of polluted water by the activated sludge method is provided in that a mixture of polluted water and recycled sludge is subjected to biological treatments in at least two treatment zones, and maintaining ...

14.10.1998
4 EP869931A1
NANOPORÖSE KERAMIKEN MIT KATALYTISCHER FUNKTIONALITÄT;NANOPOROUS CERAMICS WITH CATALYTIC FUNCTIONALITY;CERAMIQUES NANOPOREUSES AVEC UNE ACTIVITE CATALYTIQUE

The present invention provides for amorphous, nanoporous, catalytic metal-containing ceramic material having a surface area in excess of 70 m2/gm and characterized by a high content of open microporous cell structure wherein the micropores have a mean width of less than 20 Angstroms and wherein said microporous structure comprises a volume of greater than about 0.03 cm3/gm of the ceramic. The inve...

14.10.1998
5 EP870241A1
ÜBERGANGSPROTOKOLL FÜR DYNAMISCHEN SPEICHER;PROTOCOL FOR COMMUNICATION WITH DYNAMIC MEMORY;PROTOCOLE DE COMMUNICATION POUR MEMOIRE DYNAMIQUE

A system and method for performing data transfers within a computer system is provided. The system includes a controller configured to dynamically adjust the interleave of the communications are to be performed. The controller is able to vary the time interval between the transmission of control information that requests a data transfer and the performance of the data transfer by signalling the be...

14.10.1998
6 EP870485A2
MODULARE HÜLLE FÜR EINE GLIEDSTUMPFPROTHESE;MODULAR LINER FOR LIMB STUMP PROSTHESIS;GAINE MODULAIRE POUR PROTHÈSE DE MOIGNON DE MEMBRE

Apparatus for effecting comfortable fitting of a prosthetic appliance over an amputee's limb stump which has an irregular surface. The apparatus includes a liner surrounding the stump. The liner is, in turn, at least indirectly, connected to the artificial limb. A vacuum pump is provided, the pump serving to draw vacuum at an interface of the stump and an inner wall of the liner, and a plurality o...

14.10.1998
7 EP870627A1
VORRICHTUNG MIT HALBLEITER;SEMICONDUCTOR DEVICE;DISPOSITIF A SEMI-CONDUCTEUR

Condenser (114), coil (115) and thin-thickness integrated circuit (312) are placed between the upper cover sheet (117) and the lower cover sheet (118), and adhesive (119) is filled into the space among them, whereby a card is fabricated. Because condenser (114), coil (115) and thin-thickness integrated circuit (312) are extremely thin, the resulting semiconductor device is strong to bending and hi...

14.10.1998
8 EP870740A1
PERLITMATERIAL;IMPROVEMENTS IN PERLITE MATERIALS;MATÉRIAU EN PERLITE

An improved expanded perlite composition having a bulk density below about 150kg/m3 is useful for building insulation especially for flooring and comprises a binder in an amount of 15 to 35wt% of the composition, where the binder is a mixture of wax and 5 to 15wt% of ethylene-vinyl acetate copolymer. The composition offers improved physical properties and improved production methods.

14.10.1998
9 EP871134A2
VERFAHREN ZUM ZUGRIFF AUF DATENBANKINFORMATION;ACCESSING DATABASE INFORMATION;MÉTHODE D'ACCÉS AUX INFORMATIONS D'UNE BASE DE DONNÉES

Routines for manipulating data in a database are performed by a database server by determining whether or not a database manipulation routine is to be isolated from a specified range of memory, and, in response, selectively switching memory access permission to the specified range of memory (e.g., from read/write to read-only) for the database manipulation routine under consideration. The database...

14.10.1998
10 EP871219A2
SUBSTRAT FÜR HALBLEITERSCHALTKREIS AUF METALL-GRUNDLAGE;METAL-BASED SEMICONDUCTOR CIRCUIT SUBSTRATES;SUBSTRAT POUR CIRCUIT SEMICONDUCTEUR À BASE DE MÉTAL

Polyimide layers having special properties are formed on the bottom surface of a metallic body for a metal-based semiconductor circuit substrate with a polyimide layer as an insulator. There are four lamination methods: (a) a method in which a layer of thermoplastic polyimide resin (1) and a layer of non-thermoplastic polyimide resin are laminated on the bottom surface of the metallic body one ove...

14.10.1998
11 EP712534B1
3-DIMENSIONALES GEHÄUSE FÜR MONOLITHISCHE INTEGRIERTE MIKROWELLEN/MILLIMETERWELLETERWELLEN-SCHALTUNGEN;THREE DIMENSIONAL PACKAGE FOR MONOLITHIC MICROWAVE/MILLIMETERWAVE INTEGRATED CIRCUITS;MODULE A TROIS DIMENSIONS POUR CIRCUITS INTEGRES MONOLITHIQUES A MICROONDES/ONDES MILLIMETRIQUES

A three-dimensional interconnect package is provided for monolithic microwave/millimeterwave integrated circuits. A mating substrate for receiving an MMIC has transmission lines disposed over its surfaces. The mating substrate mounted substantially vertical in a base substrate which also has transmission lines for carrying microwave/millimeterwave signals. The transmission lines on both substrates...

14.10.1998
12 EP725434A3
MIKROCHIP MODULARE ANORDNUNGEN;MICROCHIP MODULE ASSEMBLIES;ASSEMBLAGES MODULAIRES DE MICROPUCES

Low profile microchip module assemblies are formed by first mounting one or more active semiconductor integrated circuit chips on a multilayer metallisation and dielectric structure on a substrate of, say, silicon or alumina, by wire bonding or flip-chip solder bonding, and then inverting the substrate and mounting it on a printed circuit board by means of solder bump connections. The solder bump ...

14.10.1998
13 EP768375B1
MILCHBAKTERIEN;LACTIC BACTERIA;BACTÉRIE LACTIQUE

Biologically pure culture of a lactic bacterium strain selected for its abilities to implant in an intestinal flora, adhesion to intestinal cells, competitive exclusion of pathogenic bacteria on intestinal cells, immunomodulation and/or reduction in fecal enzyme activity.

14.10.1998
14 EP794059A3
TINTENSTRAHLSCHREIBER MIT DRUCKREGULIERTER FREIER TINTENZUFÜHRUNG;PRESSURE REGULATOR FREE INK INK JET PEN;DISPOSITIF D'ÉCRITURE À JET D'ENCRE DE TYPE ENCRE LIBRE À PRESSION RÉGULÉE

The present invention relates to free-ink type ink-jet pens. A dual-chambered housing forms ink accumulators which provide a local supply of ink for a printhead mechanism. The accumulators are fluidically coupled to an off-board ink reservoir by a valve mechanism. A pressure regulator mechanism is incorporated into a chamber for maintaining a predetermined gage set point back-pressure within the p...

14.10.1998
15 EP808865A3
GESCHÄUMTES FLUORPOLYMER;FOAMED FLUOROPOLYMER;FLUOROPOLYMÈRE EXPANSÉ

Fabricated articles of fluoropolymer are foamed by heating the articles to a deformable state, pressurizing the heated article with supercritical CO2, depressurizing the pressurized heated article while still in the foamable state, whereby said CO2 foams said article, and cooling the resultant foamed article.

14.10.1998
16 CZ9004041A3
PROCESS FOR PREPARING TERPENES;ZPŮSOB VÝROBY TERPENŮ

A terpene compound having the formula (III) is produced by reacting an allylic halide having the formula (I) with a Grignard reagent having the formula (II) in the presence of anhydrous zinc chloride and a copper compound or an organic zinc halide compound having the formula (IV) in the presence of a copper compound, provided that when A-A is C-C, R min is hydrogen and when A-A is C=C, X is chlor...

14.10.1998
17 CZ9800809A3
COATING COMPOUND AND THE USE THEREOF;NANÁŠECÍ HMOTA A JEJÍ POUŽITÍ

Coating material (I) with a film-forming aqueous synthetic resin dispersion containing a high concentration of salt for lowering the freezing point, plus UV and chemical crosslinkers which are blocked by keeping the pH value above 9 with ammonia until the crosslinking mechanism is brought into operation by evaporation of ammonia.

14.10.1998
18 CZ9800846A3
FOAM FOR FILLING JOINTS;MONTÁŽNÍ PĚNA PRO ZAPLŇOVÁNÍ SPÁR

An insulating board joint filler foam, for use in the regions of door or window frames or the like, consists of a light mineral mortar based on a lime-cement mortar with added aluminium powder, the mortar exhibiting 30-40% expansion on water addition. Preferably, the light mortar contains (by wt.) 50 parts white cement, 43 parts silicate filler, 4 parts binder, 0.5 parts additives and, as foaming ...

14.10.1998
19 CZ9801760A3
NOVEL BINDING PHASE FOR PHOSPHOMAGNESIUM CEMENTS AND THEIR USE FOR PREPARING MORTAR;NOVÁ VAZEBNÁ FÁZE PRO FOSFOHOŘEČNATÉ CEMENTY A JEJICH POUŽITÍ PRO PŘÍPRAVU MALTY

The invention relates to a phosphomagnesium cement obtained by mixing water and a binding phase based on at least one phosphorus compound, at least one magnesium compound and at least one inorganic compound, characterized in that the inorganic compound is introduced in the form:- either of particles (1) of size smaller than 0.1 mu m,- or of aggregates (2) of size smaller than 0.1 mu m,- or of ag...

14.10.1998
20 CN1195617A
POWER SUPPLY SYSTEM FOR ELECTRIC VEHICLE

An electric vehicle whose wheels are powered by a d.c. power supply includes a combination of a rechargeable high-energy battery and a rechargeable high-power battery or to a hybrid electric vehicle whose wheels are powered by the d.c. power supply and an internal combustion engine. The d.c. power supply is formed by connecting a d.c. circuit which comprises a rechargeable high-power battery and a...

14.10.1998