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| № |
Patent number |
Title of the invention and abstract piece | Date of publication of the patent |
|---|---|---|---|
| 1 | JP2712958B2 |
No name | 16.02.1998 |
| 2 | JP2712964B2 |
No name | 16.02.1998 |
| 3 | JP2712966B2 |
No name | 16.02.1998 |
| 4 | JP2712967B2 |
No name
PURPOSE:To enable a printed wiring to be protected against disconnection at an environmental test or the like by a method wherein a nickel plating layer and a gold plating layer which cove a copper wiring and a resist layer which covers a record surface are provided. CONSTITUTION:A semiconductor device is equipped with a printed wiring board 3 which includes a first surface section composed of sem... |
16.02.1998 |
| 5 | JP2712968B2 |
No name | 16.02.1998 |
| 6 | JP2712969B2 |
No name | 16.02.1998 |
| 7 | JP2712972B2 |
No name | 16.02.1998 |
| 8 | JP2712973B2 |
No name | 16.02.1998 |
| 9 | JP2712974B2 |
No name | 16.02.1998 |
| 10 | JP2712975B2 |
No name | 16.02.1998 |
| 11 | JP2712976B2 |
No name | 16.02.1998 |
| 12 | JP2713021B2 |
No name | 16.02.1998 |
| 13 | JP2713022B2 |
No name | 16.02.1998 |
| 14 | JP2713024B2 |
No name | 16.02.1998 |
| 15 | JP2713025B2 |
No name | 16.02.1998 |
| 16 | JP2713026B2 |
No name | 16.02.1998 |
| 17 | JP2713030B2 |
No name | 16.02.1998 |
| 18 | JP2713033B2 |
No name | 16.02.1998 |
| 19 | JP2713035B2 |
No name | 16.02.1998 |
| 20 | JP2713038B2 |
No name | 16.02.1998 |