Utilization of the "dead space" previously occupied by a metal stiffener in an integrated circuit package as a location for power conditioning and converting mechanisms such as decoupling capacitors and planar transformers.

A socket coupled to a circuit board to receive a package of microelectronic device has one or more electrical contacts coupled to its outer surfaces. Each contact provides a low inductance shunt connection from the side of the package to the circuit board. The contact includes multiple adjacent, electrically conductive members, each including a rigid portion and a flexible portion projecting from ...

In one embodiment, a memory card comprises a card substrate, at least one memory chip attached to the card substrate, a control chip mounted on the memory chip, bonding wires electrically connecting the chips with the card substrate, a passive device attached to the card substrate near the memory chip, and a molded body encapsulating the memory chip, the control chip, the bonding wires and the pas...

A low profile stack semiconductor package is proposed. A lower chip having centrally-situated bond pads is mounted on a substrate, and electrically connected to the substrate by bonding wires. A cushion member is peripherally situated on the lower chip, allowing the bonding wires to extend from the bond pads in a direction parallel to the lower chip, and to reach the cushion member beyond which th...

A package for mounting an integrated circuit die. In one embodiment the package comprises a metal substrate having first and second primary opposed surfaces and an aperture formed therebetween. A flexible thin film interconnect structure having bottom and top opposing surfaces is formed over the first primary surface of the metal substrate and over the aperture such that a first region of the bott...

A flip-chip package uses a substrate having bond pad spacing that matches terminal spacing on a chip at an elevated temperature, such as the temperature of the chip during bonding to the substrate, the melting point of solder used on the chip, a temperature within the range of thermal cycling of the chip, or an operating temperature of the chip. Matching spacing at an elevated temperature permits ...

An electroluminescent light-emitting device having a light-emitting surface area and including (a) an electroluminescent light-emitting layer containing an electroluminescent material, and (b) an electrode layer formed on one of opposite sides of the electroluminescent light-emitting layer and including a first electrode and a second electrode which are formed in respective predetermined patterns ...

A flat panel display which makes it possible to increase the proportion of the display occupied by the effective display region is constructed by arranging an input terminal portion on an outside surface or the periphery of the flat panel display, mounting an electronic circuit to an inside surface or an outside surface of a sealing cap, and forming wires on the inside surface or the outside surfa...

A semiconductor system includes a plurality of semiconductor chips, a first group of wirings, a second group of wirings and a connection rearrange wiring section. The first group of wirings interconnect the plurality of semiconductor chips. The second group of wirings are used for redundancy and interconnect the plurality of semiconductor chips. The connection rearrange wiring section includes a c...

The present invention provides a magnetic head slider including rails formed on the medium-facing surface on the magnetic disk side for generating buoyant force so that the slider flies and moves above a magnetic disk to write or read magnetic information. In the magnetic head slider, a first carbon film having corrosion resistance is provided on the surfaces of the rails provided on the medium-fa...

A multi-chip module and a fabricating method thereof are proposed, in which two or more chips are simultaneously integrated in a package unit and then connected to a printed circuit board for providing a manifold level of functionality and data storage capacity. The multi-chip module includes at least a first chip and a second chip, wherein the second chip is connected to the first chip through ch...

A method for manufacturing a grip material consisting of a layer of polyurethane and a layer of EVA. A nylon cloth material is used as a temporary support for coagulating the polyurethane by a wet coagulation process. The coagulated polyurethane is then separated from the nylon cloth material and subsequently joined with a strip of EVA material to yield a grip material with the tackiness and super...

A multiple integrated circuit chip structure provides interchip communication between integrated circuit chips of the structure with no ESD protection circuits and no input/output circuitry. The interchip communication is between internal circuits of the integrated circuit chips. The multiple integrated circuit chip structure has an interchip interface circuit to selectively connect internal circu...

A semiconductor device which includes: a semiconductor chip bonded to a surface of a solid device; and a stiffener surrounding the periphery of the semiconductor chip. A surface of the stiffener opposite from the solid device is generally flush with a surface of the semiconductor chip opposite from the solid device.

An apparatus and method for providing a co-extruded, tapered multi-layer shaft. A co-extruded, tapered multi-layer shaft may be fabricated by selecting a first material for the inner layer of the shaft and a second material for the outer layer of the shaft. The first and second materials are then co-extruded by a co-extrusion system including a puller with programmable tapering capabilities. The s...

Multi-phase RF ablation employing a two-dimensional or three-dimensional electrode array produces a multitude of currents paths on the surface of the ablation zone. This results in a uniform lesion with a size defined by the span of the electrode array. An orthogonal electrode catheter array suitable for cardiac ablation is used in conjunction with a two-phase RF power source to produce uniform sq...

PCT No. PCT/FI94/00413 Sec. 371 Date Jun. 6, 1996 Sec. 102(e) Date Jun. 6, 1996 PCT Filed Sep. 19, 1994 PCT Pub. No. WO95/08900 PCT Pub. Date Mar. 30, 1995A mobile communication system and a method for connecting a remote workstation to a data network via a mobile communication network, which allow a remote workstation to be connected more flexibly over a radio path by providing a special intercon...

According to the present invention, there is provided an ink jet recording apparatus for recording an image on a recording medium by discharging ink to the surface of the recording medium, wherein ink is reserved in an ink tank including a negative pressure generating member, such as an absorber and a foaming member, and a function of accurately detecting the residual quantity such that depletion ...

According to the invention, a novel guide member for integrally forming the fastening parts with the urethane mold and an integral molding method using said guide member are provided. The guide member comprises a guide portion that has an extended body which includes concave cross-section and at least one opening end, and isolation members provided near the ends of said guide portion. Said isolati...

PCT No. PCT/IB96/00569 Sec. 371 Date Nov. 20, 1997 Sec. 102(e) Date Nov. 20, 1997 PCT Filed Jun. 7, 1996 PCT Pub. No. WO96/41592 PCT Pub. Date Dec. 27, 1996A bifurcated endovascular stent is formed by a pair of tube-defining members, one of which is open at its ends and has a lateral opening between its ends. The other tubular structure is adapted to be advanced into one end of the first tube and ...