PURPOSE:To avoid a liquid from staying between a bursting plate and a vacuum support by radially arranging a plurality of support materials like ribs of an umbrella to form a frame structure. CONSTITUTION:A vacuum support 30 is of a dome type framed structure formed by radially arranging six support materials 36 like ribs of an umbrella extending from the center circular contact plate 32 to a peri...

A system for high speed acquisition and storage of data from transient electrical signal waveforms sampled in time at a multiplicity of points, and where it is desired to collect and store data in real time in a mass storage unit, but where the data rate is in excess of the apparent rate at which data can be transferred to mass storage. The overall system employs two levels of data reduction, the ...

A downhole screw motor comprises a casing (1) containing inside it working organs consisting of two elements: an external one which is made as a bushing (2) with inner spiral teeth (2'), and an internal one which is made as a shaft (3) provided with external spiral teeth (3'). The teeth (2') and (3') of the bushing (2) and the shaft (3) are in the permanent meshing. The bushing (2) is connected to...

A method for operably adjusting a leading strip of a forming board of papermaking wire wherein the position and length of an impinging papermaking slurry is detected and the length of the leading strip adjusted.

An improved method and related apparatus are provided for making convertible top for automobiles and the like, wherein top deck and side quarter panels of fabric-based material cooperatively form rain gutters extending along the opposite sides of the top deck panel. The top deck and each side quarter panel for a convertible top are initially sewn together in overlying relation near one side margin...

An improved metal tape for tape automated bonding provides for enhanced heat dissipation from the packaged semiconductor device. The invention includes two aspects. In the first aspect, individual metal tape leads are extended inward beyond the peripheral bonding pads of the semiconductor and over the active region of the semiconductor device. In this way, the leads are able to conduct heat away f...