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1 SE8602509A
SETT OCH ANORDNING FOR FRAMSTELLNING AV EN PLASTHUD

An apparatus for the production of a synthetic resin skin uses a mold for forming at least two separate skin sections which are then joined prior or after a final heat treatment. The synthetic resin skin sections are produced in at least two separate mold members, and the skin sections are then caused to contact each other along determined faces or margins which are joined under light pressure. An...

06.12.1986
2 JP61195897U
<назва відсутня>
06.12.1986
3 JP61195898U
<назва відсутня>
06.12.1986
4 JP61275912A
TOTAL DIRECTION VISUAL SYSTEM FOR CONTROLLING MOBILE MACHINE

An optical sensor apparatus receives visible light and converts that light to electrical signals for use by a control system. Visible light enters the apparatus through a hemispherical "fisheye" lens which provides a 360 DEG field of view in azimuth and a 180 DEG field of view in elevation. The light exiting the fisheye lens is projected through a shutter mechanism onto a receptor of a camera. Th...

06.12.1986
5 JP61276549A
ELECTRODE MATERIAL FOR SPARK GAP

1. Use of a sintered multi-phase tungsten alloy in which the proportion of tungsten is between 80 and 95%, and - in which the first phase comprises tungsten grains having an average diameter < 5 mu m and, - of which the second phase is a metal or an alloy containing one or more of the metals Ni, Cu, Fe, Co, Mo or Re as its main constituent, and - in which the tungsten grains of the first phase are...

06.12.1986
6 JP61276616A
WASTES TREATMENT DEVICE IN SHIP

PURPOSE:To treat wastes in ship economically and effectively by a single device using a system in which bilge water is concentrated by using the waste heat of engines in ship and then burned by using the heat of combustion gases of waste oils and solid combustibles. CONSTITUTION:Bilge is spread over the inside of a tank 1, and its moisture is evaporated by air heated by the cooling water in the ja...

06.12.1986
7 JP61057335B
<назва відсутня>

Acylated chitin derivatives prepared by acylating a soluble derivative of chitin using an organic acid anhydride hitherto have not been able to effectively adsorb or separate substances with a molecular weight greater than 70,000. This problem has now been overcome by effecting acylation in the presence of a diluent, a porosity-regulating agent and one or more surfactant so as to obtain a porous a...

06.12.1986
8 JP61057341B
<назва відсутня>

A process which improves the handleability of resilient, acrylic graft rubber particles which comprises coagulating the rubber particles, then contacting the coagulated particles in the coagulation medium with a dispersion of a non-resilient alkyl methacrylate resin and coagulating the alkyl methacrylate resin on the surface of the rubber particles. The particles of alkyl methacrylate resin adhere...

06.12.1986
9 JP61276959A
PRODUCTION OF NB3SN SUPERCONDUCTIVE WIRE

PURPOSE:To obtain a fine Nb3Sn superconductive wire having multi-cored structure by subjecting a small-sized ingot which contains less segregation and impurities and has excellent workability to cold working and aggregating many sets of many assemblies of such worked materials and Sn (alloy) thereby constituting the composite body equiv. to a large-sized ingot. CONSTITUTION:Many pieces of the Nb b...

06.12.1986
10 DK262886A
SYREHOLDIG BLANDING TIL BEHANDLING AF STENOVERFLADER OG FREMGANGSMAADE TIL BEHANDLING AF STENOVERFLADER

A process for treating a stone surface is disclosed. Stone floor surfaces, such as, marble and terrazzo, are treated with an acid conditioner followed by buffing with a crystallizing agent whereby a durable, high gloss finish is produced in situ on the floor surface.

06.12.1986
11 JP61057332B
<назва відсутня>

The surface of a shaped article of a vinyl chloride-based resin is subjected to two-step exposure to low temperature plasma produced in low pressure gaseous atmospheres. One of the two steps is performed in an atmosphere of a nitrogen-containing organic compound such as an amine, amide or diamine. The other step is performed in an atmosphere of an organic silicon compound such as an alkoxy-contain...

06.12.1986
12 JP61195742U
<назва відсутня>

An apparatus such as a dry shaver comprises a housing formed by two opposing housing sections accommodating an electric motor therewithin. A first outwardly extending mounting rim and a second outwardly extending mounting rim are provided on the electric motor, the second mounting rim being spaced from the first mounting rim. The first and second mounting rims engage the two housing sections and a...

06.12.1986
13 JP61276311A
TERMINAL PIN

PURPOSE:To prevent the slip of winding of a coil and to make an inserting hole of terminal pin on a printed board small by providing a depressed workpiece part on a coil winding part. CONSTITUTION:A round pin part 4 on a terminal pin 1 is in the columnar state. A depressed workpiece part 2, one of the workpiece part 2, 3, is provided to the winding part, and the other work piece 3 is provided to t...

06.12.1986
14 JP61276239A
SEALING MEMBER FOR ELECTRONIC PARTS

PURPOSE:To obtain a sealing member for electronic parts having a superiorly curable joint enabling to control flow of an adhesive, and moreover checking generation of a blow-hole by a method wherein the adhesives of two layers consisting of epoxy resin components of respectively specified two kinds are formed at the joint of the sealing member. CONSTITUTION:The joint between a substrate 4 and a co...

06.12.1986
15 JP61276470A
SCANNING TYPE IMAGE READING DEVICE

PURPOSE:To prolong the service life and highly stabilize a light detecting section and to improve photoelectric efficiency by using a light beam of prescribed wavelength range and using a silicon photodiode as a photodetector. CONSTITUTION:Light emitted from a laser equipment 1 is made to parallel light by a lens 2, reflected and scanned by a light deflector 3. Scanning light is converged by a len...

06.12.1986
16 JP61276513A
SEAT FRAME
06.12.1986
17 JP61276984A
TRANSFER MATERIAL, ANTISTAINING MATERIAL AND PRODUCTION THEREOF

Material having antifouling particles embedded in one surface is made by a transfer process. A sticky backing web is fed through a dip sticky side up. A charge of particles rolls in the dip, being unable to follow the web up a rise unless adhered to its surface in a layer. After coating the layer with a bonding agent a part cured elastomer sheet is brought into contact with the particles which are...

06.12.1986
18 IS3104A7
BUNATHUR TIL TENGINGAR MILLI RAFGREININGARKERJA METH AFAR H BETAA SPENNU, TIL FRAMLEITHSLU BETA BETALI, UTBUINN METH EINU AFLRAFKERFI OG ÖTHRU OH BETATHU RAFKERFI TIL STILLINGAR BETA SEGULSVITHINU;BúNAðUR TIL TENGINGAR MILLI RAFGREININGARKERJA MEð AFAR HáA SPENNU, TIL FRAMLEIðSLU á áLI, úTBúINN MEð EINU AFLRAFKERFI OG öðRU óHáðU RAFKERFI TIL STILLINGAR á SEGULSVIðINU

The invention relates to a circuit for electrical connection between two successive cells of a series or row, designed for the production of aluminium by electrolysis of alumina dissolved in molten cryolite by the Hall-Heroult process at an intensity of at least 150 kA and possibly attaining from 500 to 600 kA. The circuit for the electrical supply of the cells comprises, in addition to the circui...

06.12.1986
19 JP61275946A
CASH MMU SYSTEM

A cache and memory management system architecture and associated protocol is disclosed. The cache and memory management system is comprised of a set associative memory cache subsystem, a set associative translation logic memory subsystem, hardwired page translation, selectable access mode logic, and selectively enablable instruction prefetch logic. The cache and memory management system includes a...

06.12.1986
20 JP61276245A
SEMICONDUCTOR INTEGRATE CIRCUIT DEVICE

PURPOSE:To reduce stress applied to a chip on resin seal, and to protect the chip by forming a die pad section for a frame to a recessed shape and housing and arranging the chip into the recessed section. CONSTITUTION:A semiconductor integrated circuit 3 is loaded to a die pad section 6 for a frame 2, and the peripheral section of the integrated circuit 3 is sealed with a resin 1. The die pad sect...

06.12.1986