The invention concerns a method of preparing compacts having a sintered density of above 7.3 g/cm<3>. This method comprises the steps of subjecting an annealed, water-atomised, essentially carbon free stainless steel powder, which in addition to iron, comprises at least 10% by weight of chromium, not more than 0.4%, preferably not more than 0.3% by weight of oxygen, not more than 0.05%, preferably...

This invention is a device for producing the metal powder which is composed of a high pressure water tank, a nozzle for spraying a gaseous mixture of oxygen and hydrogen, a section for supplying an elemental metal material and a pressure container with an ignition device and a combustion chamber. The device allows the economical production of a metal powder, in particular a titanium metal powder, ...

A primer useful in the preparation of an anti-fouling surface contains (I) a copolymer formed from acrylates, free carboxyl group containing monomer and an aromatic sulfonic acid or salt, an acrylic polymeric resin and a cross-linking agent.

The present invention provides a display apparatus in which there is no shorting between the electrodes and cathode, and there is little variation in the amount of emitted light within a single luminescent layer. A display apparatus is employed in which first and second bank layers are extended to the peripheral edge section of electrodes, the first bank layer is extended farther towards the cente...

To provide a polyimide film having an original film width of at least 500 mm, whose isotropy in a width direction is improved to have uniform properties, which polyimide film has been apt to cause property difference in the width direction by continuous molding. The polyimide film has an original film width of at least 500 mm and a thickness of at most 50 mum, wherein the maximum value of MOR-c is...

In an apparatus for packaging piece goods, a piece-goods article of a first type (A) and a plurality of piece goods of a second type (B) are introduced into a common pack. The apparatus has a first conveyor (1), for feeding piece goods of the first type (A), a second conveyor (3), for feeding piece goods of a second type (B), and a packing station (7), for forming a flexible tube (72). It also has...

The present invention provides a cyclic olefin addition copolymer which has a reactive silyl group having a specific structure, excels in optical transparency, heat resistance, and adhesion, and is capable of producing a crosslinked product having improved dimensional stability, solvent resistance, and chemical resistance. The present invention also provides a process for producing the cyclic olef...

A method of efficiently removing a low molecular weight substance from a polyimide precursor or polyimide in which the low molecular weight substance is dispersed as micro-domains, without using a large amount of an organic solvent. The method of removing a low molecular weight substance comprises subjecting either a polymer composition having a micro-domain structure made up of a continuous phase...

The present invention provides an optical pickup-use object lens (15) having a numerical aperture of at least 0.8, for correcting light, within a wavelength range of several nm based on up to 420 nm, for chromatic aberration at an image point on the optical axis. The object lens comprises, in an arranged order from a light source, a first lens group (GR1) having a compound plane (S2) of a refracti...

A method for trying to supply a potential customer with at least one selected product offer out of a set of available product offers is proposed. The product offers are provided by a product supplier, whereby each available product offer comprises a product description. When the product supplier further has provided at least one supplier constraint concerning the potential customer and the potenti...

A semiconductor memory device includes a conductive layer filling a contact hole, a bottom electrode having a depression and electrically connected to the conductive layer, a dielectric film formed on the bottom electrode along the depression, and a top electrode formed on the dielectric film. The conductive layer and the dielectric film directly contact each other at a top surface of the conducti...

A ferroelectric memory (436) includes a plurality of memory cells (73, 82, 100) each containing a ferroelectric thin film (15) including a microscopically composite material having a ferroelectric component (18) and a dielectric component (19), the dielectric component being a different chemical compound than the ferroelectric component. The dielectric component is preferably a fluxor, i.e., a mat...

In a wireless telecommunications network, when a wireless telephone user is placed on an on-hold status by the other party, additional information/data is downloaded (pushed) to the telephone user's display screen on their telephone using a wireless application protocol to the user's web-enabled telephone. There are thus parallel connections established-the voice connection and the data connection...

A system in package structure includes a first substrate, a first chip, a first heat slug, a second substrate, and a second chip. In this case, the first chip is mounted on and electrically connected to the first substrate, and the first heat slug is located above the first chip. The first heat slug includes a thermal-conductive portion for enhancing heat releasing. The second chip is mounted on a...

An optical device. The optical device includes a substrate, an optical sensor, a plurality of spacers, a plurality of wires, and a transparent molding compound. The optical sensor is attached to the substrate, wherein a surface of the optical sensor for receiving an optical signal is the far side from the substrate. The spacers are distributed over between the substrate and optical sensor. The wir...

The present invention provides a wire bonding ball grid array (BGA) package. On a conductive metal layer of a substrate used for carrying a die, a power ring for providing an operating voltage to a core circuit of the die is disposed in the inner side of a power ring for providing an operating voltage to an input/output circuit of the die. When the die is packaged by flip chip packaging instead of...

(1) A heat sink type BGA package is disclosed, in which a metal heat sink is joined to one side of a plastic circuit board which has a cutout space in the central portion. The heat sink type BGA package is composed of a clamping member joining the plastic circuit board and the heat sink plate. A caulking member, a rivet, a screw, an eyelet, or a tubular rivet could be used as the clamping member. ...

The invention provides a hydrophilic resin and an absorbent article, both of which display still less coloring and discoloring when preserved for a long time. The hydrophilic resin is any one of: (1) a hydrophilic resin, obtained by a process including the step of polymerizing a monomer component including a major proportion of either one or both of acrylic acid and its salt which merely have a co...

A parallel hardware-based multithreaded processor is described. The processor includes a general purpose processor that coordinates system functions and a plurality of microengines that support multiple hardware threads or contexts. The processor also includes a memory control system that has a first memory controller that sorts memory references based on whether the memory references are directed...

The present invention provides a lead frame semiconductor device for exposing the inner structure of the bonding welding pad with high reliability and the manufacturing method thereof, the circuit substrate, and the electric machine. The semiconductor device comprises: a semiconductor device 30, and a bonding pad 14 formed with the end of the thin wall portion 16 thinner than the central portion 1...