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| № п/п |
Номер патенту |
Назва винаходу та фрагмент реферату | Дата публікації патента |
|---|---|---|---|
| 1 | TW393354B |
CUTTING TOOL ASSEMBLY AND DISPLACEMENT MECHANISM
A miniature cutting tool comprising integrally formed rear and front hollow shank portions, the front shank portion being elongated and being of substantially lesser radial dimensions than that of the rear shank portion; a cutting head releasably centered and keyed against rotation with respect to a free end of said front shank portion; an elongated draw rod extending through said front shank port... |
11.06.2000 |
| 2 | TW393424B |
PACKAGING UNIT FOR CONTINUOUSLY PRODUCING SEALED PACKAGES, CONTAINING POURABLE FOOD PRODUCTS, FROM A TUBE OF PACKAGING MATERIAL
A packaging unit (1) for continuously producing aseptic sealed packages (2), containing a pourable food product, from a tube (14) of packaging material filled with the food product and fed along a vertical supply path (A); the unit (1) has a first and second chain conveyor (10, 11) respectively having a number of jaws (12) and a number of counter-jaws (13), which interact with the tube (14) to gri... |
11.06.2000 |
| 3 | TW393517B |
AN FE-CR-NI ALLOY FOR USE AS A PART AUTOMOATIC LOOM AND A WEAR-RESISTANT PART OF AUTOMATIC LOOM
Wear resistance of the parts 7, 12 of an automatic loom is improved, so that neither fluff nor rupture of yarn occurs during the operation of an automatic loom. The Fe-Cr-Ni alloy used for the parts 7, 12 consists of from 13 to 20% of Cr, from 4 to 15% of Ni and the balance being Fe and unavoidable impurities, and has a microstructure that is 60% or more strain-induced martensite. |
11.06.2000 |
| 4 | CA2291922A1 |
ROTARY STEERABLE WELL DRILLING SYSTEM UTILIZING SLIDING SLEEVE;SYSTEME DE FORAGE DE PUITS ROTATIF ORIENTABLE UTILISANT UN MANCHON COULISSANT
An actively controlled rotary steerable drilling system for directional drilling of wells, the system having a rotary drive component rotatable within a tubular sliding tool collar that incorporates elastic anti-rotation members to maintain a coupled relation with the borehole wall during drilling. An offsetting mandrel is supported within the tool collar by a knuckle joint for pivotal movement an... |
11.06.2000 |
| 5 | CA2292111A1 |
ISOCYANATE-BASED POLYMERS AND PROCESS FOR PRODUCTION THEREOF;POLYMERES A BASE D'ISOCYANATE ET PROCEDE POUR LEUR PRODUCTION
An isocyanate-based polymer foam comprising an isocyanate-based polymer foam matrix having disposed therein a particulate material having an enthalpy of endothermic phase transition of at least about 50 J/g. A process for producing the foam is also described. During the process, the particulate material acts as a heat sink and will undergo an endothermic phase change by absorbing a significant por... |
11.06.2000 |
| 6 | TW393392B |
FIBER REINFORCEMENT-CONTAINING POLYOLEFIN COMPOSITION, AND FIBER-REINFORCEDRESIN MOLDED ARTICLE USING THE SAME
Disclosed is a fiber reinforcement-containing polyolefin composition comprising a polyolefin resin component containing a graft modified polyolefin and/or an ionomer; a long fiber reinforcement having an average fiber diameter of 3 to 21 mu m, of which fibers are arranged and dispersed in a pellet having a length of 3 to 30 mm prepared by molding the polyolefin resin component, in nearly parallel ... |
11.06.2000 |
| 7 | TW393448B |
PROCESS FOR RENDERING ASH INERT
Process for rendering ash inert, according to which a reactant selected from phosphoric acid and alkali metal phosphates is added to the ash, the phosphate-containing mixture thus obtained is subjected to puddling with water and a hydraulic binder so as to form a hydraulic mortar, and the mortar is subjected to setting and hardening. |
11.06.2000 |
| 8 | TW393491B |
NON-AQUEOUS SOLVENT FREE PROCESS FOR MAKING UV CURABLE ADHESIVES AND SEALANTS FROM EPOXIDIZED MONOHYDROXYLATED DIENE POLYMERS
The invention herein is a non-aqueous solvent free process for producing UV curable adhesive and sealant compositions comprising a tackifying resin and a monohydroxylated epoxidized polydiene polymer which is comprised of at least two polymerizable ethenically unsaturated hydrocarbon monomers wherein at least one is a diene monomer which yields unsaturation suitable for epoxidation and wherein the... |
11.06.2000 |
| 9 | TW393502B |
HIGH MOISTURE BARRIER POLYPROPYLENE-BASED FILM
A polymeric film having improved moisture barrier characteristic and enhanced mechanical properties. The film has a base layer which includes a blend of a high crystallinity polypropylene having an isotactic stereoregularity greater than 93%, a conventional isotactic polypropylene having an isotactic stereoregularity of from 90% to 93%, and up to 9% by weight of a resin modifier. |
11.06.2000 |
| 10 | FI982676A |
MENETELMÄ JA KALLIONPORAUSLAITE KALLIONPORAUKSEN OHJAAMISEKSI;FÖRFARANDE OCH BERGSBORRNINGSANORDNING FÖR STYRNING AV BERGSBORRNING
A method and a rock drilling apparatus for drilling holes in rock according to a predetermined drilling plan. The method comprises measuring the location of each hole in the rock by inserting a measuring device into the hole, and calculating the deviation of the end of the measured hole from the location determined in the drilling plan. The rock drilling apparatus comprises a measuring device that... |
11.06.2000 |
| 11 | TW393655B |
SEMICONDUCTOR CAPACITANCE DEVICE AND SEMICONDUCTOR DEVICE FOR MADE BY USING THE SAME
The semiconductor capacitance device contains the first capacitance component(30) with the first voltage by coefficient K1(0), the second capacitance component(32) of the second voltage by coefficient K2 (20) with opposite sign of the first voltage by coefficient K1 and the wiring level (24,28) parallel with or having series with the first and the second capacitance component.The first capacitance... |
11.06.2000 |
| 12 | TW393361B |
DEVICE AND METHOD FOR COMPENSATING THE DEFORMATION OF A MACHINE ELEMENT AND POSSIBLE SUPPORTING MEANS
Device and method for compensating a non plastic deformation of a first machine element (2) and possible supporting means (7), said first machine element (2) at least comprising machining means (1) and being fixed to a second machine element (3) in linear operation at least comprising one feed slide (4) and one linear motor (5). The device is characterised in, that said feed slide (4) and linear m... |
11.06.2000 |
| 13 | CA2292461A1 |
CASKET BED;LIT A CERCUEIL
A casket bed comprises a rectangular bed frame formed from a pair of side rails, a pair of end rails, a plurality of cross braces spanning between the side rails and a plurality of bed straps spanning between the end rails. The cross braces are adjustably movable along the side rails. The bed straps have first ends directly connected to one of the end rails. Each cross brace includes a plurality o... |
11.06.2000 |
| 14 | TW393315B |
HIP-JOINT PROSTHESIS
Hip-joint endoprosthesis with a stem (1) which is to be inserted into the femur, is connected in one piece to a neck bearing (4) at its upper end and has longitudinal grooves (5). To ensure that the longitudinal grooves are accessible from the proximal direction in the event of a follow-up operation, the neck bearing is provided with cutouts in the area of the longitudinal grooves. The neck bearin... |
11.06.2000 |
| 15 | TW393602B |
CACHE SUB-ARRAY METHOD AND APPARATUS FOR USE IN MICROPROCESSOR INTEGRATED CIRCUITS
A cache sub-array method and apparatus for use in microprocessor integrated circuits. A processor unit is disposed within a central region of the microprocessor integrated circuit; a peripheral region is designated as a cache memory array region and surrounds the central region; a predetermined number of cache memory sub-arrays are placed in the peripheral region such that variable size cache memo... |
11.06.2000 |
| 16 | TW393608B |
A FLASH MEMORY SYSTEM PROVIDING BOTH BIOS AND USER STORAGE CAPABILITY, AN INTEGRATED CIRCUIT PACKAGE, AND A MEMORY SYSTEM FOR COMPUTER
A flash memory system having a controller and a flash memory device for providing BIOS, operating system and user storage capabilities is disclosed. According to exemplary embodiments of the present invention, flash memory systems can be designed as integrated circuit packages which are pin compatible with conventional ROM BIOS chips so that existing systems can be readily upgraded without extens... |
11.06.2000 |
| 17 | TW393623B |
CONSTANT RECONSTRUCTING PROCESSOR WHICH SUPPORTS REDUCTIONS IN CODE SIZE
A processor includes a constant register 36 for storing a constant, a format decoder 21 for decoding a format code located in the P0.0 field of an instruction stored in the instruction register 10, and a constant register control unit 32 which, when the format decoder 21 has decoded that the instruction includes a constant to be stored in the constant register 36, shifts the presently stored value... |
11.06.2000 |
| 18 | TW393513B |
ENHANCED TRIPLE-HELIX AND DOUBLE-HELIX FORMATION WITH OLIGOMERS CONTAINING MODIFIED PYRIMIDINES
Novel oligomers are disclosed which have enhanced ability with respect to forming duplexes or triplexes compared with oligomers containing only conventional bases. The oligomers contain the bases 5-(1-Propynyl)uracil, 5-(1-propynyl)cytosine or related analogs. The oligomers of the invention are capable of (I) forming triplexes with various target sequences such as virus or oncogene sequences by co... |
11.06.2000 |
| 19 | TW393640B |
FLEXIBLE FUSE PLACEMENT IN REDUNDANT SEMICONDUCTOR MEMORY
Disclosed is a semiconductor memory having a main memory cell array and redundant memory cells, with a plurality of fuse that can be physically separated from their associated fuse latches. Physical separation is possible by incorporating serial transfer circuitry to serially transfer fuse data from the fuses towards the latches. As a result, only a small number of wires are needed to connect the ... |
11.06.2000 |
| 20 | TW393709B |
FLIP CHIP ASSEMBLY WITH VIA INTERCONNECTION
A flip chip assembly, and methods of forming the same, including a single layer or multilayer substrate in which via holes serve as connections between a semiconductor chip and the substrate. The assembling steps comprise attaching an integrated circuit chip to a rigid or flexible dielectric substrate having a plurality of via holes for connecting respective traces in the substrate with respectiv... |
11.06.2000 |