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1 US7191415B2
CLEARANCE INSPECTION APPARATUS AND CLEARANCE INSPECTION METHOD

A clearance inspection apparatus for inspecting clearance of a wiring line passing between vias on a substrate comprises: first determining means for determining vias adjacent on both sides of a reference via as first adjacent vias, the reference via and the first adjacent vias belonging to a first via row, wherein the reference via serves as a reference in clearance inspection; second determining...

13.03.2007
2 BRPI0417083A
VÁLVULA DE ALÌVIO DE PRESSÃO DE DOIS ESTÁGIOS

"VáLVULA DE ALìVIO DE PRESSãO DE DOIS ESTáGIOS". Uma válvula de alívio de pressão de dois estágios para uso com sistemas hidráulicos é revelada. A válvula de alívio de pressão de dois estágios tem um primeiro estágio que alivia o aumento na pressão do sistema hidráulico sobre a pressão de operação normal e até um nível de pressão limite selecionado, e um segundo estágio que traz a pressão do siste...

13.03.2007
3 KR100694611B1
DESK CALENDER WITH SUPPORTING MEMBER AND CALENDER FOR THE SAME

A desk calendar having a support part is provided to be environment-friendly by excluding an adhesive agent containing harmful ingredients and to cut down the cost without using a spring. The desk calendar(100) comprises a support part(110) and a calendar part(130). The support part is composed of a bottom plate(111) folded inward or unfolded outward; a front plate(113) inclined from the front sid...

13.03.2007
4 KR100694805B1
HOLLOW PRESTRESSED CONCRETE HPC GIRDER AND SPLICED HOLLOW PRESTRESSED CONCRETE GIRDER S-HPC BRIDGE CONSTRUCTION METHOD

Provided is a hollow prestressed concrete girder for forming an I-type prestressed concrete girder bridge, in which at least one hole is formed in a body portion of the I-type prestressed concrete girder. A spliced hollow prestressed concrete girder bridge, in which a plurality of holes are formed in a body portion of the girder to reduce the weight of the girder, is constructed by carrying a plur...

13.03.2007
5 KR100694871B1
GATEWAY SYSTEM FOR MOBILE SERVICES ON THE OPEN CELLULAR NETWORK, AND SERVICE METHOD THEREOF

A gateway system for a mobile service in a wireless open network and a service method thereof are provided to transmit a session ID received from a PM to a mobile terminal, maintain a communication session with the mobile terminal by using the session ID, receive contents from an application server by transmitting the session ID and a contents service request to a converter if receiving the conten...

13.03.2007
6 KR100692581B1
COMBO SYSTEM OF MODULE BOX COUPLING SCHEME

A combo system having a detachable module box is provided to allow a user to mount and use only a necessary module box in a smart combo TV. A module(100) for outputting the video and audio of a DVD(Digital Video Disc), a VCR(Video Cassette Recorder), and digital broadcasting is formed as a module box of a slot type which can be attached/detached to/from a combo-type TV(200). The combo-type TV(200)...

13.03.2007
7 KR100692588B1
METHOD FOR DETERMINING OPTIMUM RECORDING POWER AND OPTICAL DISK RECORDING/REPRODUCING APPARATUS TO BE APPLIED

A method for determining the optimum recording power and an optical recording and reproducing apparatus to which the method is applied are provided to determine the optimum recording power by using an asymmetry signal characteristic having a linear decrease area after a saturation point and a modulation signal characteristic having a linear increase area after the saturation point among recording ...

13.03.2007
8 KR100692591B1
DIGITAL VIDEO DISPLAY DEVICE AND METHOD FOR SETTING TIME THEREOF

A digital image display device and a time setup method therefor are provided to set accurate local time information by using PSIP(Program and System Information Protocol) data extracted from a broadcasting signal and local information received by a GPS(Global Positioning System). A tuner unit(110) receives a broadcasting signal. A demultiplexing unit(120) extracts PSIP data from the received broad...

13.03.2007
9 KR100692657B1
METHOD AND DEVICE FOR SIMULTANEOUS SERVICE IPV4 AND IPV6 ADDRESS IN DIAL-UP NETWORKING

A dial-up networking method for both IPv4(Internet Protocol version 4) and IPv6 services and a device therefor are provided to extract an available IPv4 address and an available IPv6 address to service the extracted addresses to a terminal, as IPv4 and IPv6 address requests are received from the terminal, thus the terminal can access IPv4 and IPv6 networks through the IPv4 and IPv6 addresses. A te...

13.03.2007
10 KR100693145B1
PRINTED CIRCUIT BOARD MAKING METHOD

A method for manufacturing a printed circuit board is provided to reduce the number of processes for manufacturing the printed circuit board by removing a filling up via-hole and forming a plating layer for opening/closing filler processes. A method for manufacturing a printed circuit board includes steps of: forming a via-hole which penetrates a first dielectric layer including a first metal laye...

13.03.2007
11 US7189600B2
METHODS FOR FABRICATING STIFFENERS FOR FLEXIBLE SUBSTRATES

Methods for fabricating stiffeners for flexible substrates, including, but not limited to, tapes, films, or other connective structures, which are configured to be secured to other semiconductor device components, are fabricated under control of a program. The stiffeners may be formed by selectively depositing or consolidating unconsolidated material. They may include a plurality of mutually adher...

13.03.2007
12 US7189954B2
MICROELECTRONIC IMAGERS WITH OPTICAL DEVICES AND METHODS OF MANUFACTURING SUCH MICROELECTRONIC IMAGERS

Microelectronic imager assemblies comprising a workpiece including a substrate and a plurality of imaging dies on and/or in the substrate. The substrate includes a front side and a back side, and the imaging dies comprise imaging sensors at the front side of the substrate and external contacts operatively coupled to the image sensors. The microelectronic imager assembly further comprises optics su...

13.03.2007
13 US7190062B1
EMBEDDED LEADFRAME SEMICONDUCTOR PACKAGE

A semiconductor package comprising a substrate having opposed top and bottom surfaces and a conductive pattern formed thereon. Disposed on the top surface of the substrate is a semiconductor die which is electrically connected to the conductive pattern. Also disposed on the top surface of the substrate is a leadframe which is electrically connected to the conductive pattern as well. A package body...

13.03.2007
14 US7190066B2
HEAT SPREADER AND PACKAGE STRUCTURE UTILIZING THE SAME

A heat spreader and package structure utilizing the same. The heat spreader is embedded in an encapsulant of a package and above a chip therein, wherein the package has a substrate, having a molding gate, and the chip has a center and a corner which is the farthest from the molding gate. The spreader includes a base with a hollow portion therethrough, a plurality of support leads, protruding from ...

13.03.2007
15 US7190068B2
BOTTOM HEAT SPREADER

Embodiments of the invention provide a microelectronic device having a heat spreader positioned between a chip and substrate to which the chip is electrically connected. For one embodiment of the invention, the heat spreader is a thermal slug having a coefficient of thermal expansion approximately equal to the coefficient of thermal expansion of the chip.

13.03.2007
16 US7190072B2
RFID-CHIP HAVING RFID-TAG OR MAGNIFYING ELECTRODE

When an RFID-tag is formed by joining a semiconductor chip (RFID chip) to an antenna consisting of a rolled metal foil or the like using ultrasonic waves, the pressure impressed to the semiconductor chip is suppressed to avoid the damage of the semiconductor chip. For this purpose, the present invention provides an RFID-tag 1 wherein gold bumps are joined to the metal foil by pressing the gold bum...

13.03.2007
17 US7190585B2
THERMAL HEAT SPREADERS DESIGNED FOR LOWER COST MANUFACTURABILITY, LOWER MASS AND INCREASED THERMAL PERFORMANCE

A heat spreader, comprising a metal body with attached standoffs located approximately above the integrated circuit, is described. The standoffs should improve bond layer thickness control between the integrated circuit and the heat spreader, leading to a lower cost and lower mass package, as well as a more reliable device with increased thermal performance.

13.03.2007
18 US7188520B2
LIQUID CONSUMPTION STATUS DETECTING METHOD, LIQUID CONTAINER, AND INK CARTRIDGE

A method of detecting a consumption status of liquid contained in a liquid container, comprising steps of: preparing a detection device having a piezoelectric element and attaching the detection device on a desired position of the liquid container so that at least a part of the detection device contacting the liquid; measuring a residual vibration of the detection device; and detecting the consump...

13.03.2007
19 US7188918B2
INK DELIVERY SYSTEM ADAPTER

A large variety of ink delivery systems for an existing ink-jet printing system are provided. The ink delivery systems include ink reservoirs of varying configuration and size which are capable of accommodating a variety of ink use rates. Each ink delivery system also has an electrical connector and an information storage device which are suitable for the various ink use rates. The information sto...

13.03.2007
20 US7189390B2
PROBIOTICS FOR PET FOOD APPLICATIONS

The present invention relates to novel lactic acid bacterial micro-organisms that have been isolated and selected for their probiotic potential and their use for the preparation of petfood compositions intended to improve the health of pets, and to compositions containing the same.

13.03.2007