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1 US6432630B1
MICRO-FLOW SYSTEM FOR PARTICLE SEPARATION AND ANALYSIS

A micro flow system is provided for separating particles, comprising a microfabricated member having a flow channel (5) defined therein for guiding a flow of a fluid containing the particles through the flow channel, first inlet means (2) positioned at one end of the flow channel for entering the fluid into the flow channel, first outlet means (7) positioned at the other end of the flow channel fo...

13.08.2002
2 US6432752B1
STEREOLITHOGRAPHIC METHODS FOR FABRICATING HERMETIC SEMICONDUCTOR DEVICE PACKAGES AND SEMICONDUCTOR DEVICES INCLUDING STEREOLITHOGRAPHICALLY FABRICATED HERMETIC PACKAGES

A stereolithographically fabricated, substantially hermetic package. The package surrounds at least a portion of a semiconductor die so as to substantially hermetically seal the same. The substantially hermetic package may be fabricated from thermoplastic glass, other types of glass, ceramics, or metals. Stereolithographic processes are used to fabricate at least a portion of the substantially her...

13.08.2002
3 US6432843B1
METHODS OF MANUFACTURING INTEGRATED CIRCUIT DEVICES IN WHICH A SPIN ON GLASS INSULATION LAYER IS DISSOLVED SO AS TO RECESS THE SPIN ON GLASS INSULATION LAYER FROM THE UPPER SURFACE OF A PATTERN

An integrated circuit device is manufactured by forming a pattern on a substrate. The pattern may include two or more mesa regions. The pattern and the substrate are coated with a spin on glass layer and then the spin on glass layer is dissolved so that the spin on glass layer is recessed from upper surfaces of the mesa regions opposite the substrate. Before dissolving the spin on glass layer, a t...

13.08.2002
4 US6433360B1
STRUCTURE AND METHOD OF TESTING FAILED OR RETURNED DIE TO DETERMINE FAILURE LOCATION AND TYPE

A structure and method for testing a failed integrated circuit device includes a ball grid array substrate with its heat sink removed to form a cavity where a failed bare die is to be placed. An adhesive tape is attached to the lower surface of the ball grid array substrate covering the cavity, and the die is placed into the cavity against the sticky side of the adhesive tape. Wire bonds are forme...

13.08.2002
5 US6433425B1
ELECTRONIC PACKAGE INTERCONNECT STRUCTURE COMPRISING LEAD-FREE SOLDERS

A method and structure for forming an electronic package with an interconnect structure that comprises lead-free solders. The method first forms a module by initially providing a chip carrier, a first joiner solder that is lead-free, and a core interconnect (e.g., solder ball, solder column) that includes a lead-free core solder. The liquidus temperature TIL of the first joiner solder is less than...

13.08.2002
6 US6434017B1
SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS

A semiconductor device in a chip size package form having a high durability and reliability and realizing a small size with high density, and an electronic apparatus mounting the same, connected to a motherboard by soldering, comprising a semiconductor chip wherein bumps are formed on pad portions thereof; an interposer supporting the bumps mechanically and having through-holes wherein conductors ...

13.08.2002
7 US6434387B1
METHOD FOR CONTROLLING HANDOFF IN MOBILE COMMUNICATIONS SYSTEMS

A method for controlling handoff in mobile communications systems, includes making base station output changes for a number of users into database to store it in an inner memory and detecting a number of channels in use for CDMA channels to store, measuring and storing pilot power strength of the base station in service and continuously detecting those of neighboring base stations, so that a pilot...

13.08.2002
8 US6434738B1
SYSTEM AND METHOD FOR TESTING COMPUTER SOFTWARE

A system and method is provided in which the correctness of computer code fragments may be tested. In an example embodiment, a web-based automatic code correctness checking tool is provided for distance learning. A student may submit to the system a solution to a selected exercise. The solution is processed and verified by a server system, which may provide hints and/or error messages to the stude...

13.08.2002
9 KR20020065045A
SEMICONDUCTOR CHIP PACKAGE INCLUDING EXTENDED PADS

PURPOSE: A semiconductor chip package including extended pads is provided to improve reliability of a semiconductor chip package by preventing a crack generating between a solder ball and a ball pad. CONSTITUTION: A semiconductor chip(110) is mounted on an upper surface of a substrate(120). A plurality of bonding pads(112) is connected with a metal wire on the substrate(120) by a connection portio...

13.08.2002
10 KR20020065198A
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

PURPOSE: A semiconductor package and a method for fabricating the same are provided to prevent a crack of a semiconductor chip by improving a structure of an adhesive and a chip loading region of a circuit film member. CONSTITUTION: A circuit film member(10) is formed with a resin film(16), a conductive pattern(18), and a cover coat(32). The resin film(16) is adhered to a window of a carrier frame...

13.08.2002
11 KR20020065232A
ADAPTOR HAVING ROTATIVE PLUG

PURPOSE: An adaptor having a rotative plug is provided to rotate the plug on the left and the right, to exclude an interference with a neighboring plug, and to maintain an electrical connection in the rotative plug, thereby preventing connection inferiority. CONSTITUTION: A plug unit is composed of a front unit and a rotative unit for fixing a plug. The rotative unit is cylinder-typed to form a gr...

13.08.2002
12 JP2002223669A
FISHING LURE AND SINKER TO BE USED THEREFOR

PROBLEM TO BE SOLVED: To provide a fishing lure easy to adjust its weight even in the dark and retaining its left and right balance in making a practical fishing. SOLUTION: This fishing lure 1 has the following construction: the lure body 3 includes a hooked sinker part 10, and another sinker body 15 with a sinker 16 linked via a connective part 17 to the sinker part 10 is detachable from the lure...

13.08.2002
13 JP2002223761A
METHOD FOR DETECTING TARGET NUCLEIC ACID AND REAGENT THEREFOR

PROBLEM TO BE SOLVED: To provide a method for easily and simply detecting a target nucleic acid. SOLUTION: The subjective method for detecting a target nucleic acid comprises the steps of acting a chimeric nucleic acid probe consisting of DNA and RNA and a double strand-specific exodeoxyribonuclease on a target nucleic acid, hybrid-binding the probe, digesting a DNA part of the chimeric nucleic ac...

13.08.2002
14 JP2002223920A
TEA POT

PROBLEM TO BE SOLVED: To simplify the structure of a percolation type tea pot and to simply and surely pour hot tea water. SOLUTION: This tea pot is obtained by combining a pot body provided with a pouring port for the hot tea water and a percolation cup which is supported attachably and detachably at a mouth part of this pot body and houses the tea leaves with hot water inside of it to percolate ...

13.08.2002
15 JP2002223935A
FOLDING SHEET

PROBLEM TO BE SOLVED: To make it possible to lessen the bending stress required for bending in folding and to make both of mountain folding and valley folding to expand the width of bent portions. SOLUTION: Plural streaky grooves (3) and (4) are disposed in proximity on the respective front and rear surfaces of the sheet (2) made of plastic. The respective grooves face each other on the front and ...

13.08.2002
16 JP2002224039A
FUNDUS CAMERA

PROBLEM TO BE SOLVED: To provide a fundus camera capable of removing a flare from a peripheral part of a cornea and a crystalline lens even if the thickness of the cornea and the crystalline lens of an optometrical eye is different. SOLUTION: This fundus camera has an illuminating optical system 1 for illuminating the eyeground Ef of the optometrical eye E via flare removing light shielding plates...

13.08.2002
17 JP2002224090A
INSPECTION METHOD FOR BODY FLUID COMPONENT AND INSPECTION INSTRUMENT USED THEREOF

PROBLEM TO BE SOLVED: To provide an inspection method for body fluid components and an inspection instrument used therefor capable of surely transferring an analyte A by a simple pressing operation without requiring a large-scale mechanical device such as a pump, surely measuring the analyte A, and reducing the running cost. SOLUTION: This inspection instrument is provided with an analyte feeding ...

13.08.2002
18 JP2002224306A
GAME MACHINE

PROBLEM TO BE SOLVED: To provide a game machine capable of using a plurality of sound sources, while reducing the capacity for sound effect data, and storing data about many kinds of sound effects. SOLUTION: A sound board 43 is provided with a one-chip microcomputer 101 for controlling the sound board 43. A CPU 101a for controlling the sound board 43, a ROM 101b for storing the control program of ...

13.08.2002
19 JP2002224711A
MANUFACTURING METHOD OF SEAMLESS PIPE

PROBLEM TO BE SOLVED: To provide a manufacturing method of seamless pipes excellent in properties of the inner wall and the internal body. SOLUTION: Circular billets hot-rolled from slabs made at continuous casters whose segregation displacement ratio P(%) is 5 to 40% are used. The definition of P is as the following: P(%)=(&Delta d/D)× 100 where P: segregation displacement ratio (%), &Delta ...

13.08.2002
20 JP2002224885A
CURABLE FLUX, SOLDER JOINT PART, SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide curable flux capable of keeping electrical insulating properties even under the atmosphere of high temperature and high humidity without needing any cleaning and removal of residual flux after soldering and attaining the soldering high in joining strength and reliability. SOLUTION: The curable flux consists essentially of a compound having at least two or more cyan...

13.08.2002