PURPOSE:To simplify and facilitate formation of plates for a lead storage battery by performing the formation while a porous plate impregnated with electrolyte is interposed between a formation counter electrode and a plate to be formed. CONSTITUTION:A porous plate 3 made of glass fiber or similar material is closely interposed between a nonformed negative plate 2 installed in a negative container...

1. A film with a matt and rough surface, which consists of a major proportion of a low molecular vinyl chloride polymer and a minor proportion of a high molecular vinyl chloride polymer and a filler, as well as lubricants and a heat stabilizer, and which has been produced by the roll kneading/calendering process, which film consists of a) 65 to 97% by weight of a low molecular vinyl chloride polym...

PURPOSE:To make it feasible to clean up an item with complicated shape such as an instrument to be used for manufacturing a semiconductor device by a method wherein multiple brushes are immersed in clearing solution together with the item to be cleaned up before agitating the cleaning solution. CONSTITUTION:A commercial household electric washer may be utilized for cleaning operation while 600 eac...

PURPOSE:To obtain the titled device of high moisture resistance and high reliability by a method wherein the grain size of the filler in a sealing resin is made smaller than the thickness of a passivation film. CONSTITUTION:The grain size of the filler 9 in the sealing resin 6 is made smaller than the thickness of the passivation film 8. This can prevent the filler 9 from thrusting into the passiv...

PURPOSE:To enable a semiconductor chip to be shielded from a high electric field impressed on the package by a method wherein leads led outside the resin sealed body are bent to the surface side of the semiconductor chip, so as to be mounted to a substrate as it is. CONSTITUTION:The lower bonding pad 9 of a semiconductor chip 7 is wire- bonded to the lower surface of an outer lead 11 with a wire 1...

PURPOSE:To obtain a semiconductor device in molded structure having excellent damp-proofing and reliability by forming a chip coating in double structure of a resin having the small coefficient of linear expansion and a hydrophobic resin. CONSTITUTION:A resin 11 for chip coating having the coefficient of linear expasion in the same extent as an alumina pate 2 is mounted only onto an silicon chip 5...