A magnetic immersion field emission electron gun has a vacuum vessel having a central axis in a predetermined direction, a cathode arranged along the central axis of the vacuum vessel for generating an electron beam, an anode for forming an electron beam path by accelerating a generated electron beam in the central axis direction, an electrostatic lens arranged between the cathode and anode for ge...

A thin gauge, fine diameter steel cord reinforced tire ply fabric 2 is disclosed which can be effectively lap spliced without detrimental effect. The steel cord 1 has one or more filaments 9, each filament has a percent elongation of over 2.5% and tensile strength of at least (-2000D+4400 MPa) x 95%, where D is the diameter of the filament in millimeters. For passenger and lightly loaded trucks th...

This invention relates to a swivel caster fitted with rotational and swivel angle measurement sensors mounted to a driverless vehicle so that the lateral motion of the vehicle can be detected and accounted for by the vehicle's navigation and guidance system. A preferred embodiment of the present invention is a driverless vehicle comprising a navigation and guidance system having an angular motion ...

A capacitor element of a semiconductor device used for a super-LSI is formed by the steps including (a) removing a natural oxide film on a surface of a lower electrode of polysilicon, (b) forming on the surface of the lower electrode an impurity-doped tantalum oxide film, and (c) forming an upper electrode with at least a bottom thereof constituted by titanium nitride. The steps may further includ...

Le procédé de détection automatique des zones expertisables dans une image de pièce mécanique comporte une première phase (1) pendant laquelle les zones d'au moins une image de référence sont détectées au moyen d'une segmentation manuelle, une deuxième phase (2) pendant laquelle des paramètres de marquage des zones sont définis et fixés, ces paramètres de marquage étant des transformations de simp...

According to this invention, there is provided a multilevel wiring substrate comprising, a base substrate having first and second surface and including first and second areas, said first area including first and second level conductive layers insulated from each other, a plurality of first vertical conductive layers electrically connected to said first level conductive layer so as to provide first...

A semiconductor package for emitting heat is described that can be applicable to ASICs having a high frequency characteristic or a semiconductor memory device requiring a high speed. The semiconductor package is provided with at least one semiconductor chip equipped over a substrate, bonding means for electrically connect the semiconductor chip to the substrate, heat emitting means which include ...

A pallet lay-up system utilizes a method in which spool-shaped paper supports wound with integral end flanges are processed in sequential linear arrays for adhesive attachment to first and second corrugated paperboard deck sheets applied in separate lay-up stations. The method may be readily modified, utilizing the same basic system, to manufacture a wide variety of pallet and pallet-like structur...

A method of forming an intermittent stabilized length of a coextruded trim strip product. The method includes coextruding two strips of a thermoplastic material around intermittent sections of a stabilizing insert by a split extrusion die and forming rolls. A cutter cuts the trim strip product between the intermittent stabilizing sections so as to define trim strip products having ends without sta...

2,3-dihydroxy propyl 2-amino(1-oxo alkyl) 2-desoxy-glucopyranosides of formula (I) are new. R = 5-21(pref. 7-17)C alkyl.

A hybrid circuit includes an insulative film (5) bonded to a first area of a die attach pad, a second area (3A) of the die attach pad being exposed. A plurality of individual metalized strips (6, 11, 12) and a first die attach area (7) are formed on the film. A first integrated circuit die, (8), such as a low power MOS chip, is bonded to the first die attach area, and a second integrated circuit d...

Semiconductor chip assemblies incorporating flexible, sheetlike elements (42) having terminals thereon overlying the front or rear face of the chip to provide a compact unit. The terminals (48) on the sheetlike element are movable with respect to the chip, so as to compensate for thermal expansion. A resilient element such as a compliant layer (42) interposed between the chip and terminals permits...

The lead structure has several lead electrodes (3) which project solely from one side of a flat semiconductor housing (1). The lead electrodes connect to a wiring section of an electronic component. A guide hole (1) is drilled in the semiconductor package to guide the wiring section of the electronic component. An independent lead electrodes (12) projects from the housing at a site corresponding t...

A panel (12,12') for an office sound screen includes a core (20,20') which includes an asphalt layer (22) and insulation layers (24,24') positioned on both sides of the asphalt layer. Preferably the asphalt layer has a thickness between 0.030 inch (0.076 cm) and 0.125 inch (0.318 cm). The asphalt layer acts as an adhesive so that the insulation layers are laminated thereto. Preferably the insulati...

The solid state sensing pick-up device manufacturing method includes the steps of: forming a protective layer on photosensitive region of the image pick-up device on a silicon wafer; die-cutting the protective-layered image device, connecting pads of the cut device with leads of a leadframe, and packaging the chip with a molding die which has a salient contacting on the protective layer; removing...