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1 US7415528B2
APPARATUS AND METHOD FOR TRANSMITTING HIERARCHICALLY MULTIMEDIA DATA TS TO PREVENT JITTER OF TIMING INFORMATION AND FOR RECOVERING THE MULTIMEDIA DATA TS

An apparatus and a method for transmitting multimedia transport stream hierarchically and recovering the multimedia transmission stream are disclosed. The apparatus includes: an input matching unit for dividing the multimedia data transport stream into packets; a sequence number inserting unit for inserting a sequence number to the packet; an error check code (ECC) inserting unit for inserting an ...

19.08.2008
2 US7415695B2
SYSTEM FOR SEARCH AND ANALYSIS OF SYSTEMATIC DEFECTS IN INTEGRATED CIRCUITS

Disclosed is a method of locating systematic defects in integrated circuits. The invention first performs a preliminary extracting and index processing of the circuit design and then performs feature searching. When performing the preliminary extracting and index processing the invention establishes a window grid for the circuit design and merges basis patterns with shapes in the circuit design wi...

19.08.2008
3 CA2486038C
PERFORATION MECHANISM FOR A FOAM-IN-BAG CUSHION AND METHOD OF USE;MECANISME DE PERFORATION POUR UN COUSSIN PRODUIT PAR COULEE DE MOUSSE ET METHODE D'UTILISATION

A perforation apparatus particularly useful for creating perforations in a foam-in-bag cushion and methods of using such apparatus are provided. The perforation apparatus is comprised of a frame, a main shaft mounted in the frame so as t o be rotatable about a central axis, at least one needle roller coupled to the ma in shaft such that rotation of the main shaft moves the needle roller through a ...

19.08.2008
4 CA2301623C
POLY(NEOPENTYL POLYOL) ESTER BASED COOLANTS AND IMPROVED ADDITIVE PACKAGE;ESTER DE POLY(NEOPENTYL POLYOL) A BASE DE REFRIGERANTS ET CONDITIONNEMENT A BASE D'ADDITIFS PERFECTIONNE

A synthetic lubricant composition is a blend of a polyol ester blend admixed with effective amounts of an antioxidant, yellow metal pacifier and rust inhibitors. The polyol ester blend includes a major proportion of poly(neopentyl polyol) ester blend formed by reacting poly(pentaerythritol) partial esters with at least one C7 to C12 carboxylic acid mixed with an ester formed by reacting a polyol h...

19.08.2008
5 CA2301675C
PROSTATE BOUNDARY SEGMENTATION FROM 2D AND 3D ULTRASOUND IMAGES;SEGMENTATION DE LIMITES DE PROSTATE A PARTIR D'IMAGES ULTRASONIQUES 2D ET 3D

A fast semi-automatic prostate contouring method is provided using model-bas ed initialization and an efficient Discrete Dynamic Contour (DDC) for boundary refinement. The user initiates the process of the preferred embodiment by identifying four (4) points on the prostate boundary, thereby scaling and shaping a prostate model, and then the final prostate contour is refined with a DDC. The method ...

19.08.2008
6 CA2361047C
METHOD AND APPARATUS FOR ASSURING SUFFICIENT BANDWIDTH OF A STATISTICAL MULTIPLEXER;PROCEDE ET DISPOSITIF ASSURANT UNE LARGEUR DE BANDE SUFFISANTE A UN MULTIPLEXEUR STATISTIQUE

Techniques for determining an output rate for a bit stream, the output rate being determined by applying information read from the bit stream to available bandwidths. The techniques are employed to construct a statistical multiplexer that multiplexes varying bit-rate bit streams onto a satellite up-link. Minimum and maximum output rates for each bit stream are determined such that neither a queue ...

19.08.2008
7 US7413130B2
PAPER TAG IDENTIFIED BY USING RADIOFREQUENCY AND METHOD OF MANUFACTURING THE SAME

A RFID tag including: a paper-like structure inlaying a RFID thread between a first paper layer and a second paper layer, the RFID thread being connected to a RFID chip through bumps to an antenna arranged onto a base member and being formed with a protecting material provided with a window at a position in which the RFID chip corresponds; wherein a height of an upper surface of the protecting mat...

19.08.2008
8 US7413625B2
BONDING METHOD OF CERAMIC HONEYCOMB STRUCTURE

Respective pieces of the porous honeycomb segments ( 2 ) are stacked while interposing the adhesive layers between respective adhered surfaces ( 2 a), and are bonded together by performing main pressurization (F 1 , F 2 ) on the whole through the porous honeycomb segments ( 2 ) located on an outermost layer after stacking a predetermined number of pieces. Main pressurization force at this time is ...

19.08.2008
9 US7413655B2
METHOD FOR THE BIOLOGICAL BREAKDOWN OF EFFLUENT CONTAINING NITROAROMATICS

A method for the biodegradation of nitroaromatic-containing wastewater, including: (a) providing activated sludge as biological matrix, (b) adding a nitroaromatic-degrading microorganism to the activated sludge, (c) adding nitroaromatic-containing wastewater to the material of step (b) and (d) adding at least one carbon source which is more readily utilizable than the nitroaromatic to be degraded ...

19.08.2008
10 US7413656B2
AEROBIC SEWAGE SYSTEM

An aerobic system provided to treat sewage generated by a modern larger home which does not have access to a municipal sewage connection The features of this system are adaptable to upgrade and/or replace existing systems. In a preferred embodiment the system uses two 1000 gallon tanks, a first pretreatment tank to receive raw sewage, remove settleable and floatable solids from the sewage, and dis...

19.08.2008
11 US7413717B2
CERAMIC HONEYCOMB STRUCTURAL BODY AND METHOD OF MANUFACTURING THE STRUCTURAL BODY

The ceramic honeycomb structure according to the present invention includes a cell group having a plurality of cells which are divided each other by porous partition walls and functioning as a fluid channel, and porous outer wall surrounding and holding outermost peripheral cells located at a circumference of the cell group. In the partition walls, a part located at least one opening end of the ce...

19.08.2008
12 US7413935B2
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

A method of fabricating a semiconductor device includes hardening resin at a temperature that is less than or equal to the boiling point of the resin and until the hardening reaction ratio of the resin has reached at least 80%, the resin being disposed between a wiring board which has an interconnecting pattern and a semiconductor chip which has a plurality of electrodes and which is mounted on th...

19.08.2008
13 US7414002B2
ALUMINUM OXIDE-TITANIUM NITRIDE SINTERED BODY, MANUFACTURING METHOD THEREOF, AND MAGNETIC HEAD SUBSTRATE, ULTRASONIC MOTOR AND DYNAMIC PRESSURE BEARING USING THE SAME

The present invention provides an aluminum oxide-titanium nitride sintered body having good resistance to electrostatic damage and small variation in volume resistivity. The aluminum oxide-titanium nitride sintered body is mainly composed of 65 to 85% by weight of aluminum oxide and titanium nitride constituting the rest. The average of the sum of the crystal grain sizes of the aluminum oxide and ...

19.08.2008
14 US7414098B2
GAS-PHASE CATALYTIC POLYMERIZATION OF OLEFINS

Process for the gas-phase catalytic polymerization of olefins carried out in a plurality of interconnected polymerization zones, the process comprising feeding one or more monomers to said polymerization zones in the presence of a catalyst under reaction conditions and collecting the polymer product from said polymerization zones, in which process the polymer particles grow within a first polymeri...

19.08.2008
15 US7414135B2
PROCESS FOR HALOMETHYL ETHERS OF HYDROXYIMINOMETHYL QUATERNARY PYRIDINIUM SALTS

A halide salt of a 1-(hydroxyiminomethyl-1-pyridino)-3-(halomethyl)-2-oxapropane is prepared by adding a pyridinealdoxime to a bis-halomethylether in such a manner that the bis-halomethylether is maintained in excess throughout the addition. This procedure produces the halide salt of a 1-(hydroxyiminomethyl-1-pyridino)-3-(halomethyl) -2-oxapropanein high yield and purity, which facilitates its use...

19.08.2008
16 US7414299B2
SEMICONDUCTOR PACKAGE ASSEMBLY AND METHOD FOR ELECTRICALLY ISOLATING MODULES

A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for electrically isolating modules according to IEEE 1394.

19.08.2008
17 US7414311B2
BALL GRID ARRAY HOUSING HAVING A COOLING FOIL

A ball grid array housing, a semiconductor device having a ball grid array housing and an electronic circuit are disclosed. In one embodiment, a ball grid array housing includes a substrate with solder ball connections pointing out from a housing and at least one semiconductor chip. For better heat dissipation from the housing, the ball grid includes a metallic cooling foil, or a metallic cooling ...

19.08.2008
18 US7414317B2
BGA PACKAGE WITH CONCAVE SHAPED BONDING PADS

In the BGA package and its manufacturing method, a bonding pad is etched from the exposed surface to a part of the insulation layer-coated region so as to form a solder contact side having a dish configuration, which is planar at a bottom center and slanted at a periphery. With this bent structure of the dish configuration, the bonding pad provides an increased bonding area for the solder, so that...

19.08.2008
19 US7414318B2
ETCHED LEADFRAME FLIPCHIP PACKAGE SYSTEM

The present invention provides an etched leadframe flipchip package system comprising forming a leadframe comprises forming contact leads and etching a plurality of multiple dotted grooves on the contact leads, and attaching a flipchip integrated circuit having solder interconnects on the contact leads between each of the plurality of the multiple dotted grooves.

19.08.2008
20 US7414810B2
MAGNETIC HEAD STRUCTURE WITH INSULATING LAYER CONFIGURED TO REDUCE THERMAL DEFORMATION OF FLOATING SURFACE TOWARDS DISK

A magnetic head structure has a coil and a magnetic pole allowing a magnetic flux generated by the coil to be transmitted therethrough and forming a magnetic gap. An insulating layer surrounds the coil, and a protective layer covers the insulating layer and the magnetic pole. The insulating layer has a volume equal to or greater than a value which is determined with respect to a thickness of the p...

19.08.2008