PURPOSE:To prevent abrupt starting when a clutch for running is engaged again after it has been disengaged by making connection in such a way that the holding action of a hold mechanism is released so as to be actuated by means of actuating the clutch so as to be engaged. CONSTITUTION:A hold plate in a flat sheet shape acting as a hold mechanism 42 is fixed on a base member 39. This permits a runn...

SE PRESENTA UN PRODUCTO PARA ABSORBER EL EXSUDADO DE LAS HERIDAS QUE COMPRENDE UNA SERIE DE BOLSAS (2) CUADRADAS O RECTANGULARES Y PERFORADAS (4) HECHAS DE UNA SUBSTANCIA DE UN GROSOR MAXIMO DE UN MILIMETRO, POR EJEMPLO UNA PELICULA, QUE ES SUBSTANCIALMENTE NO ADHERENTE A LAS HERIDAS, EN DONDE SE ALOJA ACIDO ALGINICO O UNA SAL DEL MISMO TAL COMO ALIGINATO DE CALCIO EN LAS BOLSAS, PREFERIBLEMENTE E...

LA INVENCION SE REFIERE A UNA PLACA DE MATERIAL SINTETICO, QUE PUEDE SER ELABORADA MEDIANTE EMBUTICION PROFUNDA DENTRO DE OBJETOS SANITARIOS (BANDEJAS DE BAÑO, TAZAS DE DUCHA, URINARIOS, LAVABOS). UN RECUBRIMIENTO (3) DE METACRILATO POLIMETILO (PMMA, VIDRIO ACRILICO) SE DISPONE SOBRE UN SUBSTRATO ELABORADO EN PARTICULAR A BASE DE ESTIRENO-BUTADIENO-ACRILONITRILO (ABS). EL RECUBRIMIENTO DE VIDRIO A...

A method of making a semiconductor device having a film resistive element. A resistive film is deposited over a substrate formed with a first contact hole open to an under-layer electrode region disposed in or on the substrate. The resistive layer is selectively etched to form the film resistive element and at the same time to leave portion of the resistive film disposed in and around the first co...

On a semiconductor substrate, a thin film resistor and a metal wiring for electrically extracting the thin film resistor are formed via a firth interlayer insulator. A second interlayer insulator covering the thin film resistor and the metal wiring is formed on the first insulation layer. By removing the portion of the second interlayer insulator above the thin film resistor by etching, the insula...

A semiconductor device includes a semiconductor substrate having a pair of opposed main surfaces with a wiring conductor provided on one of the main surfaces; the substrate having at least one through hole extending therethrough so as to be perpendicular to the main surfaces; at least one electrically conductive pin provided on the other of the main surfaces at a position of the at least one throu...

A refractory article for a device for controlling or interrupting a jet of steel, characterised in that it is made up of a refractory material consisting essentially of a) 61 to 77 % by weight of particles which have an alumina content greater than 50 % by weight and a melting point higher than 1800 DEG C, and b) 39 to 23 % by weight of a binding phase exhibiting an X-ray pattern in which the mo...

PURPOSE:To provide a method of manufacturing a semiconductor device and a lead frame, wherein the semiconductor device can be enhanced in plane and spatial mounting density, and a lead can be protected against bending. CONSTITUTION:Outer leads 41 are buried in a package 8. At least the contacting parts of the outer leads 41 connected to a circuit board are exposed out of the package 8, and the exp...

UNA PIEZA DE APOYO PARA CARRILES (1) PERFILADOS EN T DE UNA TAPA INFERIOR PARA LA CONEXION EN EL LADO FRONTAL EN UN PERFIL (6) DE ANGULO DE BORDE QUE DISCURRE TRANSVERSALMENTE ESTA CONFIGURADO COMO UNA PIEZA DE CHAPA ESPECIAL. LA PIEZA (7) DE APOYO ES ENCHUFABLE EN LA CARA FRONTAL CON UNA PLACA (8) DE ENCHUFE CONFIGURADA PARA ELLO EN LA PLACA (2) DE ALMA DE DOBLE PARED DEL CARRIL (1) PERFILADO EN ...

LA INVENCION SE REFIERE A UNA BOLSA DE COLOCACION VERTICAL A BASE DE PLASTICO SOLDADO O SELLADO EN CALIENTE Y DIRIGIDO PARA EL CONTENIDO DE LIQUIDO Y/O PASTAS, DISPONIENDO LA BOLSA DE DOS PAREDES (2,3) LATERALES UNIDAS UNA CON OTRA A LO LARGO DE SUS BORDES LONGITUDINALES. DISPUESTO ENTRE LOS BORDES DEL FONDO DE LAS PAREDES LATERALES SE DISPONE DE UN ELEMENTO (10) DE SUELO DE PLEGADO QUE ACTUA COMO...

UNA PLATAFORMA(1) CONSTRUIDA CON CARTON ESTA PROVISTA DE UN TABLERO (3), CON UN LADO DESPEJADO Y OTRO LADO DE BASE, Y PATAS (4), QUE ESTAN DISTRIBUIDAS SOBRE LA BASE DEL TABLERO. EL TABLERO (3) CONTIENE UN RELLENO DE CARTON EN PANEL, Y LAS PATAS (4) TAMBIEN TIENEN UN RELLENO EN PANEL, Y AMBOS RELLENOS, FORMAN UNA PIEZA (2). LA PLATAFORMA (1) ESTA, ADEMAS, PROVISTA DE UNA TAPA DE PLASTICO (5,8) QUE...

COPOLIMERIZADO CON VISCOSIDAD REDUCIDA ESPECIAL, ELABORABLE A TRAVES DE UNA POLIMERIZACION EN SUSTANCIA, DONDE EXISTE UN COMPONENTE (A) PARA EL COMIENZO DE LA POLIMERIZACION Y EN OTRO DESARROLLO SE AÑADEN AL MENOS DOS MONOMEROS (B) COPOLIMERIZABLES NO SATURADOS OLEFINICAMENTE, DE LOS QUE AL MENOS SE CONTIENE UN GRUPO COOH Y AL MENOS UN GRUPO QUE SE EVITA DE FORMA ESTERICA.; Copolymers of particula...

SE PRESENTA UNA COMPOSICION PARA LA PREVENCION DE REACCIONES INFLAMATORIAS O ALERGICAS O PARA EL TRATAMIENTO DE ENFERMEDADES CARDIOVASCULARES O HEMODINAMICAS QUE COMPRENDE UN COMPUESTO DE LA FORMULA (I), EN LA QUE R = (A), Y EL ISOMERO TRANS DE LA FORMULA (II), EN DONDE R = (B), Y LAS SALES FARMACOLOGICAMENTE ACEPTABLES DEL MISMO, Y UN PORTADOR FARMACOLOGICAMENTE ACEPTABLE.; PCT No. PCT/CA93/00558...

LA INVENCION TRATA DE PINTURAS EN POLVO, QUE CONTIENEN AL MENOS UNA RESINA DE POLIACRILATO CON GRUPOS EPOXIDO TERMINALES COMO LIGANTE, Y QUE SE CARACTERIZAN PORQUE LA RESINA DE POLIACRILATO CON GRUPOS EPOXIDO TERMINALES SE SINTETIZA POLIMERIZANDO (A) 10,00 A 50,00 % EN PESO DE UN MONOMERO ETILENICAMENTE INSATURADO, QUE AL MENOS CONTIENE EN LA MOLECULA UN GRUPO EPOXIDO, (B) 5,00 A 84,99 % EN PESO D...

An improved semiconductor device( 10) is disclosed having a predetermined amount of solder (36), or other electrically conductive binder adsorbed onto the exterior package leads (18) of the semiconductor device.(10) A de-wettable coating (24) comprising preferably nickel, or alternatively chromium, is plated to a superior portion (34) of the package leads,(18) such that, when the heat is applied t...

A semiconductor package directly soldering the chip pad to the inner leads and a method for producing the package are disclosed. The chip pad is placed on the bottom surface of an inner lead extending from opposed sides of the chip pad. A plurality of inner lead holes are formed in the interconnection parts between the inner leads and the auxiliary leads. A solder resist film bonded to the lead fr...

LA INVENCION SE REFIERE A UN PROCESO DE IMPRESION SOBRE UN PREPARADO ALIMENTICIO, PARTICULARMENTE DE UN ARTICULO DE PANADERIA, CONFITERIA, PASTELERIA, CHARCUTERIA, PAN DE VIENA, O SIMILAR. EN ESTE PROCESO, SE DEPOSITA SOBRE UN SOPORTE FLEXIBLE UNA REPRODUCCION DE DICHA SIGLA REALIZADA MEDIANTE UNA COMPOSICION PASTOSA, LLAMADA MASA, QUE COMPRENDE AL MENOS LECHE EN POLVO, MANTILLA DE CACAO, YEMA DE ...

Synthetic analogs of 2',5'-oligoadenylate wherein the aglycon, ribosyl moiety and/or terminal nucleoside have been modified are effective therapeutic agents, particularly against HIV infection. The analogs are utilized in compositions and methods for the treatment of disorders characterized by 2-5A pathway defects.

PCT No. PCT/DK90/00077 Sec. 371 Date Sep. 20, 1991 Sec. 102(e) Date Sep. 20, 1991 PCT Filed Mar. 19, 1990 PCT Pub. No. WO90/11283 PCT Pub. Date Oct. 4, 1990.A process for the preparation of 9-substituted quanine derivatives of general formula (I), in which R is C1-C4-alkyl optionally substituted with one or more hydroxy groups, or R is ( alpha ), benzyl, ribosyl, 2'-deoxyribosyl or (CH2)n-OR1 wher...