PURPOSE:To smoothly start a vehicle by speeding up an engine from its idle running when the vehicle is released from a non-creep condition, in the case of an automatic speed change system equipping a non-creep mechanism. CONSTITUTION:A central processing unit (CPU) 34, deciding a non-creep condition to be formed, outputs a control instruction for oil to a clutch by reading through an input interfa...

PURPOSE:To improve the drivability of a vehicle when it is started on a sloping road, by using a neutral control valve which automatically neutralizes a speed changer when an accelerator pedal is released to an off-state but prevents the speed changer from neutralization in the predetermined condition. CONSTITUTION:Because switches 28-32 are all closed only when a choke button 36 is not pulled und...

PURPOSE:To substantially promote the cost down of a device, by combining a part of the mechanism for automatically neutralizing the device with a part of the mechanism for detecting the kick-down action. CONSTITUTION:If the driver depresses an accelerator pedal 34 to an accelerator opening of 85% or more performing the action of kick-down with a lever in a range D, a solenoid valve 27 is closed by...

The device has at least two co-axial centrifugal masses, operating against the action of a damping device. The two masses can turn relative to each other via a roll bearing. The two masses both act against an axial springing device between them depending on the operation of a friction clutch, and are capable of limited axial movement relative to each other. The axial springing device may act on th...

PURPOSE:To prevent the island of a semiconductor chip from deforming and a bonding wire from cutting by inclining the sides of the island for placing a semiconductor chip at approx. 20-70 deg. with respect to external leads. CONSTITUTION:A lead frame having external leads 15 arranged in parallel by 9 in 2 rows, internal leads 13 coupled with the leads 15, and an island 12 supported by a tie bar 16...

PURPOSE:To prevent the electrostatic damage of an integrated circuit element by forming resistance wirings of polysilicon for forming a semiconductor substrate in a 2-layer structure to double an input protective resistance without increasing the occupying area to the substrate. CONSTITUTION:A resistance wiring layer 21 of the first layer of polysilicon is patterned in a length that the entire res...

PURPOSE:To miniaturize the device with large scale circuit integration, by using the synchronizing sampling predictive system and the asnchronizing sampling predictive system through switching depending on the magnitude of the synchronizing frequency fluctuation in an NTSC signal and corresponding one encoder for arbitrary picture signals. CONSTITUTION:The inputted picture signal of the NTSC syste...

PURPOSE:To reduce the total number of chains, to actuate a resource efficiently and to reduce vector processing time by executing two reading operations in parallel with one vector register. CONSTITUTION:Vector instructions to be executed are successively applied to a vector register control unit 1, a vector register starting circuit 2 executes necessary decoding and the decoded vector instruction...

PURPOSE:To execute every (e) primary cyclic operations in parallel by finding out an operated result picked up every plural times and then finding out its intermediate operated result from said operated result. CONSTITUTION:The values of vectors [a0, a4, a8,...], [a1, a5, a9 ...], [a2, a6, a8, ...], and [a3, a7, a11,...] are inputted to vector registers (VR) 2, 4, 6, 8 respectively. An adder 15 ad...

PURPOSE:To allow processing of cyclic-type calculation at high speed by using a vector arithmetic device on time division basis by a control circuit which divides arithmetic processing into plural fundamental processing units and controls them. CONSTITUTION:When a start instruction is executed, a phase generator 4 forms a signal which instructs a P phase, transmits data on a vector register 2 to l...

PURPOSE:To allow optional vector operation processing in which random number columns are used by using plural random number generators, and generating the optional random number columns in parallel. CONSTITUTION:A control circuit 2 reads the vector instruction from a main storage device 1 by using a bus 10, and decodes the instruction. When a vector register 4 specifiers random number generation a...

PURPOSE:To prevent the sagging of a molding resin by turning over a substrate proper immediately after the molding resin is injected and curing the resin under the state in which a guide plate is pushed against the resin. CONSTITUTION:A semiconductor element 30 is die-bonded with a substrate 10. A molding resin 60 is dropped to sections to be molded (an internal terminal 21, the semiconductor elem...

PURPOSE:To largely short the time of steps by coating an inner semiconductor element with a surface protective layer made by coating an oily resin coupling agent and a photocurable resin, and then molding an enclosure resin. CONSTITUTION:A resin coupling agent of an insulator having low viscosity of oily state is coated as a primer on the entire surface of a semiconductor substrate 2 and the entir...

Composition and method are provided for enhancing adhesive bonding to an aluminum surface and protecting the aluminum surface from corrosive and other chemical degradation. The improved bonding surface comprises a composition derived from cohydrolysis of a diamino-substituted silane and a titanate. The corrosion resistant composition is derived from a cohydrolysed composition of an oxysubstituted ...

PURPOSE:To eliminate coating of radiation shielding material by sealing a semiconductor element assembling structure in which a plate made of a material having a radiation generating amount smaller than a molding resin is bonded to the main surface of a semiconductor element with the resin. CONSTITUTION:A plate 7 formed of a material having a radiation generating amount smaller than a molding resi...

PURPOSE:To eliminate the concentration of a large stress in a boundary between external leads and a molding resin even if bending by locally reducing a sectional area of a portion led from a molding resin shell of the leads. CONSTITUTION:A nonsealed portion is formed of external leads 32 respectively connected with external leads 31 to be sealed and a fine coupling strip 9 for coupling the externa...

An integrated circuit package having a lead frame positioned between two lead glass layers on a ceramic base and a ceramic window frame bonded to the lead glass for accommodating a cap attached by a glass to gold to gold-tin eutectic bond. The various layers are applied by an advantageous combination of screen printing and fusing steps.

N<6>-(1- and 2-Benzocylcoalkyl)adenosines of the formula and the pharmaceutically acceptable acid addition salts thereof, wherein R1 is of the formula in which n is 0 or 1 are disclosed. The compounds have highly desirable central nervous system and cardiovascular properties. A process for the manufacture thereof and pharmaceutical compositions containing the same are also disclo...

PURPOSE:To improve the packaging density and to attain ease of handling in using a memory integrated circuit by changing over selectively the 1st circuit system leading a data fed to an input terminal for address designation and the 2nd circuit system leading the data for chip selection. CONSTITUTION:When a memory integrated circuit 21a where a defective cell exists in a designated memory area wit...

PURPOSE:To attain relieve of fault by means of a few program element numbers by arranging a switching circuit between a column decoder and a column selection gate circuit, transmitting an output signal of a decoder for column selection of a defective memory column to a spare column selection gate circuits so as to select a spare cell. CONSTITUTION:When an element 101 is a defective cell, it is rep...