To provide a marking method capable of easily recognizing the existence of a marking without using a special reading equipment, and also capable of avoiding a destruction of material and a deterioration of material strength. Preparing a marking object; converging, into the marking object, a laser beam having a wave length range so chosen that the laser beam can transmit through a material forming ...

A seamless flat-round conductive cable is adapted for use in a retractable cord reel having a spool on which a round portion of the cable is wound and a cable expansion chamber in which a flat portion of the cable is disposed. The cable has a plurality of seamless conductive members, each of which may comprise an inner conductor and an outer insulating layer. The cable includes a first cable porti...

The invention relates to a takeup machine for winding a continuously advancing yarn to a package, the yarn being guided in a yarn traversing mechanism which consists of a pretraversing unit and a grooved roll downstream thereof in the advance, of the yarn. To be able to change the yarn from a full package mounted on one winding spindle to an empty tube mounted on another winding spindle by rotatin...

A multiaxial press fabric includes a base fabric and a plurality of layers of staple fiber material attached to the base fabric. The base fabric has at least one layer assembled by spirally winding a woven fabric strip, and takes the form of an endless loop. Because of the spiral winding, the yarns of the woven fabric strip lie in directions different from the machine- and cross-machine directions...

This invention relates a metal powder composition for warm compaction. According to the invention, the composition comprises metal powder, graphite, an optional binding agent, optional alloying elements and a lubricant essentially consisting of ethylene-bis-stear-amide, the mixture being, before warm compaction, subjected to treatment with an organic solvent. The invention further relates to a met...

A system and method for an automated chemical mechanical planarization (CMP) machine. The system comprises a plurality of interchangeable CMP process modules. Each module is a compilation of grouped software codes called ""objects"". Process modules may be added or deleted from the system as needed, whether during the machine's assembly or during actual use. The system is configured to allow users...

A prepreg exhibiting excellent formability and producing laminated boards and multiple layer circuit boards exhibiting high thickness precision is disclosed. The prepreg comprises an inner layer made from a glass fiber substrate, having a weight of 40 g or more and less than 115 g per square meter and an air permeability or 20 cm3/cm2/sec or less, impregnated with an epoxy resin,...

Drawn polyester yarn of enhanced strength and improved adhesion properties for reinforcement of elastic structures, such as tires, conveyor belts and the like, is obtained on treatment, prior to drawing, with a low water fiber finish comprising an adhesion-promoting substance comprising a halogenated polyether containing at least one 2-halomethyloxyethylene unit and a 2,3-dihydroxypropyl end group...

The object of this invention is to provide a plasma display panel in which an aging process essential to the manufacturing process generates minimal phosphor deterioration, enabling a relatively high luminous efficiency and high quality color production to be produced. To achieve this object, the aging process takes place while gas generated inside the panel is evacuated. Alternatively, after comp...

The invention comprises first electrodes (2) that are parallel to each other, are formed on a glass substrate, and are composed of multi-stripe electrode, first dielectric layers (3) is applied to the first electrodes (2) in order to be formed on the glass substrate (1), insulation layers (4) that is composed of dielectric constant of the and that is formed on the first dielectric layers (3), seco...

This invention provides a combination structure of a passive element and a logic circuit on a silicon on insulator (SOI) wafer. A dual damascene technique is employed to combine resistors, inductors and capacitors of the passive element and the conventional logic device on the SOI wafer, which can effectively reduce the resistance of the inductor and also the area of layout as the thickness of the...

A dielectric layer for capacitive element is formed on a lower electrode. An interlayer insulating layer is formed on the lower electrode and the dielectric layer for capacitive element. A plug hole reaching the dielectric layer for capacitive element is formed in the interlayer insulating layer. Upper electrodes are formed to fill in the plug hole and positioned opposite to the lower electrode wi...

A semiconductor device and a method of making a semiconductor device. A damascene metal layer (16) is formed in an insulating dielectric layer (12), which is in direct electrical communication with a substrate (10). A layer of a passive element, such as first capacitor electrode layer (20) is disposed on metal layer (16) and preferably is offset relative to metal layer (16) to allow a direct elect...

High quality epitaxial layers (26) of compound semiconductor materials can be grown overlying large silicon wafers (22) by first growing an accommodating buffer layer (24) on a silicon wafer. The accommodating buffer layer is a layer of monocrystalline oxide spaced apart from the silicon wafer by an amorphous interface layer (28) of silicon oxide. The amorphous interface layer dissipates strain an...

A security tag for use with an electronic security system which functions within a second frequency range comprises a substantially planar dielectric substrate having first and second sides. A first conductive pattern is provided on the first side of the substrate, the first conductive pattern comprising at least a first inductive element, a first plate of a first capacitive element and a first pl...

A connection structure for electrically connecting a semiconductor chip to an external circuit device comprises: a ground metal plate connected to ground power of the semiconductor chip; an insulating layer formed on the ground metal plate; a signal pattern layer formed on the insulating layer and having signal patterns communicating electrical signals with the semiconductor chip. The ground metal...

A method and apparatus for embedding data in an encoded video bitstream, for example, an MPEG or MPEG-like bitstream, wherein the bitstrearm includes redundantly coded syntax element values of which one is ail overriding value, includes mandatorily coding the syntax element overriding value and replacing the non-overriding syntax element value with the data to be embedded. Apparatus for embedding ...

A technique for managing network elements significantly reduces the amou nt of monitoring related traffic by using a combination of aperiodic polling an d asynchronous event reporting. A global resource (e.g., a network of interconnected nodes or resources) is partitioned into a plurality of separate nodes, givin g a fixed resource budget to each of the nodes. When any of the nodes exceeds its bud...

Hollow, cylindrical, seamless metal master for producing seamless diffuser sheets of preselected length and width. Additional aspects of the invention include a hollow cylindrical seamless invertable elastomeric master and method of making the same and an apparatus and process for effecting variable diffuser recording in photosensitive medium.

The present invention relates to the electrostatic destruction (also known as electrostatic discharge, ESD) technique of semiconductor integrated circuit (IC) chip mounted in an IC card. The subject of the present invention is to provide an IC card that is capable of intensifying electrostatic destruction prevention without increasing the production cost of a semiconductor IC chip. The solving mea...