A method for the production of an aqueous dispersion by the dispersion of an inorganic pigment such as calcium carbonate and aluminum hydroxide in an aqueous medium, which method comprises incorporating in said inorganic pigment as a dispersant a carboxyl group-containing water-soluble polymer possessing a number average molecular weight in the range of 2,000 to 80,000 and/or a water-soluble conde...

A resin sealing type semiconductor apparatus includes semiconductor devices (17, 18) having electrodes (20). A plurality of leads include inner leads (15, 15a) and outer leads (12), the former connected to the electrodes (20) of the semiconductor devices (17, 18) by thin metal wires (19). A sealing resin layer covers at least the semiconductor devices (17, 18) and the inner leads (15, 15a). The ou...

Metal carbide or silicon carbide foam intended to be used as catalyst or catalyst support for the chemical or petrochemical industry or for exhaust systems, and process for its manufacture. The foam takes the form of a three-dimensional network of interconnected cages in which the length of the ridges is between 50 and 500 micrometers, whose density is between 0.03 and 0.1 g/cm<3> and whose BET su...

Chromated or passivated (phosphated) zinc and zinc alloy coatings on workpieces are provided with a protective coating which is largely inorganic and formed from titanium or zirconium chelate and/or titanium or zirconium acid ester and an organofunctional polysiloxane applied in solution form by a post-treatment dipping.

A dipping composition for the treatment of a chromatized or passivated zinc or zinc alloy coating deposited on a steel substrate is disclosed. The composition comprises titanic, acid esters, titanium chelates or mixtures thereof, organo- functional polysiloxanes and a solvent selected from the group consisting of organic solvents, preferably alcohols and hydro- carbons, water and mixtures thereof....

RETAINER FOR A SUITCASE WHEEL ASSEMBLY A transport device is provided that includes a wheel assembly having a round axle that supports a pair of wheels and a handle and that has at least two separated flattened portions. The flattened portions each have a diametrical dimension smaller than the axle diameter in one direction only. At least two first wall members extend away from a surface and are p...

According to this invention, a semiconductor chip (11) incorporating a power control element is mounted on a heat dissipation member (12) by a conductive solder (13), and lead members (14, 15) electrically connected to terminals extending from the semiconductor chip are arranged to have a surface level almost equal to that of the heat dissipation member. A main body structure including the semicon...

According to the present invention, a circuit board for mounting electronic components including a metal layer united with a substrate layer with a predetermined portion of the metal layer exposed is manufactured by disposing a mask between a substrate layer and a metal layer where the metal layer is to be exposed and uniting the substrate layer and the metal layer with the mask therebetween, proj...

A semiconductor element package and a semiconductor element package mounting distributing circuit basic plate, wherein the shield metallic layer is provided on the flexible insulating basic plate for constituting the package, so that the semiconductor element mounted on the flexible insulating basic plate may be kept electromagnetically shielded positively with the shield metallic layer, whereby t...

A conveyor installation includes an endless belt wound around head and tail pulleys which extends between an impact station wherein material is placed on the belt and a drop off zone wherein the material is removed from the belt. Shock absorbers are disposed beneath the belt at the impact station to dissipate energy imparted on the belt by the material. In one embodiment, the belt is formed of fle...

A method (215) of converting a current control channel for use as a communication (voice/data) channel, in order to maintain a predetermined level of service in a radio communications system, employs a central controller (101) to allocate a limited number of communication channels among a plurality of subscriber units (108-112). After receiving (203) a request for a communication channel from one ...

A method is employed by a central controller of a radio communications system, which method provides for sustaining a predetermined level of communication service. The system includes a plurality of voice channels which are allocated among a plurality of subscribers (108-112) using a first control channel (102). In a preferred embodiment, at least one of the voice channels (104, 106) is also contr...

To further reduce the manufacturing costs of semiconductor devices, such as TO-92 transistors or thyristors, a prefabricated plastic can or housing is filled with cast resin, and the chip, together with its leads and a synthetic-resin cover, is inserted into the cast resin and the can, with portions of the leads engaging a groove in the can. The apparatus for inserting the chips, etc., into the ca...

A film material for the manufacture of a film carrier has a lead pattern including an outer lead portion formed independent of the electrode arrangement of a semiconductor chip to be mounted on the film carrier, and an inner lead formation portion a part of which is selectively removable in accordance with the electrode arrangement of the semiconductor chip to be mounted thereon, the inner lead fo...

A method for forming microilluminants, which comprises the steps of irradiating laser beam to microparticles doped with a laser pigment in a liquid medium, trapping the microparticles and causing these microparticles to emit light. According to this method, it is possible to form microilluminants, permitting application to new physical and chemical processes and to processing and modification of m...

A hybrid semiconductor device comprises a heat sink (1) on which a plurality of semiconductor chips (2) are mounted, an insulating substrate (4) secured to the heat sink (1), conductive metallic layers (6, 7) formed on the insulating substrate (4), electrodes (6) formed on the semiconductor chips (2), first thin metallic wires (81) for connecting the electrodes (6) and the conductive metallic laye...

A semiconductor substrate comprising: a single-crystalline semiconductor wafer substrate; a strained layer superlattice (SLS) structure layer formed on the wafer substrate; and a compound semiconductor epitaxial layer formed on the SLS structure layer. According to the present invention, the SLS structure layer consists of pairs of a first compound semiconductor thin layer and a second compound se...

The invention relates to a process for the preparation of metal carbides and of silicon carbide having a high specific surface, intended especially for the manufacture of catalysts and of catalyst supports for the chemical and petrochemical industries. The process consists in reacting a volatile compound of the metal or of silicon with carbon having a high specific surface at a temperature of 900 ...