Результати пошуку
- Фільтрувати за фондом:
- Всі
- Патенти України на винаходи
- Патенти України на корисні моделі
- Патенти України на промислові зразки
- Патенти на винаходи зарубіжних країн
- Заявки на винаходи
- Свідоцтва на топографії ІМС
- Свідоцтва України на знаки для товарів та послуг
- Прийняті до розгляду заявки на знаки для товарів і послуг
- Кваліфіковані зазначення походження товарів (КЗПТ)
| № п/п |
Номер патенту |
Назва винаходу та фрагмент реферату | Дата публікації патента |
|---|---|---|---|
| 1 | JP59142157U |
<назва відсутня> | 22.09.1984 |
| 2 | JP59142521U |
<назва відсутня> | 22.09.1984 |
| 3 | JP59168865A |
SAFETY SKI BINDING
A safety ski binding includes a bearing block having an axle thereon, a sole holder pivotally supported on the axle, and a spring housing supported on the bearing block for pivotal movement about an axis which is generally parallel to the axle. A slide member is movably supported in the spring housing and is biased by a release spring into engagement with a control surface on the sole holder in th... |
22.09.1984 |
| 4 | IN154142A1 |
TIRE FOR TWO-WHEEL VEHICLE
A tire for two-wheel vehicle comprising a casing formed of a crown with a tread and two sidewalls each terminating in a bead intended to rest on a tire rim and an inner tube glued in manually removable manner to the inner wall of the casing in the region of the crown is improved due to the fact that the inner tube is glued under circumferential tension to the casing so that its inside equatorial r... |
22.09.1984 |
| 5 | JP59142190U |
<назва відсутня> | 22.09.1984 |
| 6 | JP59168666A |
SEMICONDUCTOR DEVICE
PURPOSE:To obtain a semiconductor device provided with the conductive part of a high melting point metal compound layer not to reduce adhesion with another metal layer, a substrate and an insulating film even when high temperature heat treatment is performed, and enabled to attain curtailment and simplification of the manufacturing process by a method wherein electrodes or electrode wirings, etc. ... |
22.09.1984 |
| 7 | DK159884A |
FREMGANGSMAADE OG MIDDEL TIL REPARATION AF FORSTAERKEDE ELASTOMERGENSTANDE
The repair of a reinforced elastomer article (10) having a hollow (12) therein relates to utilizing an amine curable polymer or prepolymer and a cured elastomer patch. The hollow (12) in the elastomer as well as the areas juxtaposition to the patch (20) is coated with a treating agent (30). The amine curable polymer or prepolymer (40) which may have rubber particles therein is then applied to the ... |
22.09.1984 |
| 8 | DK136984A |
GUMMISUBSTRAT MED PAAFOERT AMINHAERDELIG POLYMER ELLER PRAEPOLYMER SAMT FREMGANGSMAADE TIL PAAFOERING AF SAADANNE POLYMERE ELLER PRAEPOLYMERE PAA SUBSTRATET
A process and composition for applying and bonding an amine curable polymer or prepolymer at ambient temperatures to the surface of a cured elastomer substrate. The elastomer article or substrate is treated with an organic oxidant such as an N-halohydantoin, N-haloamide, or an N-haloimide, for example, the various isomers of mono-, di-, and trichloroisocyanuric acid. A polyisocyanate is applied th... |
22.09.1984 |
| 9 | JP59169027A |
CURRENT BREAKER | 22.09.1984 |
| 10 | IN154128A1 |
APPARATUS AND METHOD FOR LAYING PIPE-LINE
A reel and bending apparatus and method for laying pipelines from a floating vessel on the floor of a body of water in which the pipeline is capable of being unreeled from either the top or bottom of the reel and then translated through two pair of independently housed horizontally disposed rollers working in conjunction with the reel for straightening the pipe in the vertical plane. |
22.09.1984 |
| 11 | JP59168514A |
DRIVING DEVICE
PURPOSE:To use only a pair of bearings to support a carriage by controlling the drive of two orthogonal coils so as to obtain a fixed tilt of the carriage to its moving direction after putting the carriage wound by said two coils into a magnetic field. CONSTITUTION:The 1st and 2nd coils 14 and 15 are wound orthogonally round a carriage 11, and this carriage is supported by a dynamic pressure beari... |
22.09.1984 |
| 12 | JP59168993A |
SEMICONDUCTOR MEMORY
PURPOSE:To relieve partially defective semiconductor chip in a semiconductor memory that writes and reads a signal of plural bits by making connection to external terminal for inputting and outputting data only for defectless array. CONSTITUTION:Memory blocks M1-M9 are divided in relation to bonding pads D1-D9 for inputting and outputting data, and different from conventional memory mat. When ther... |
22.09.1984 |
| 13 | DK109884A |
FREMGANGSMAADE OG VARMEVEKSLER TIL KOELING AF EN AF FLERE KOMPONENTER BESTAAENDE GASSTROEM
A method is disclosed for cooling a multicomponent gas stream containing variable amounts of the components by passing the gas stream through a heat exchange relationship with a fluid coolant stream so that carry-up of the condensed phase is maintained without condensed phase backmixing over the compositional range of the multicomponent gas stream. The gas stream is cooled by passing it through a ... |
22.09.1984 |
| 14 | DK160584A |
HEATING BOILER;INTERLEUKIN-2
A method for the preparation of mature human IL-2 by direct expression of a synthetic gene coding therefor in a transformed microorganism, corresponding DNA sequences, expression vehicles and microorganisms therefor, |
22.09.1984 |
| 15 | JP59039450B |
<назва відсутня>
Pre-polymers which are alkoxylated or phenoxylated methylpolysilanes are useful for the preparation of fine grained silicon carbide ceramic materials and silicon carbide-containing ceramics. The pre-polymers exhibit ease of handling and their use to obtain silicon carbide ceramic materials results in high yields. |
22.09.1984 |
| 16 | JP59168660A |
LEAD FRAME FOR SEMICONDUCTOR
PURPOSE:To enable to construct a semiconductor device at low cost and having high reliability by a method wherein a tin or solder plated layer is provided at the die bonding part of a lead frame, and moreover an Ni or Ni alloy plated layer is provided at the wire bonding part of the lead frame. CONSTITUTION:A tin or solder plated layer 3 is provided to the die bonding part 4 of a lead frame, and m... |
22.09.1984 |
| 17 | JP59039381B |
<назва відсутня>
Method for forming conductive, transparent coating such as may be used on the interior surface of a vitreous tubular member. In a carrier gas and exterior to the member to be coated, there is formed a vapor from a material substantially comprising organic tin halide compound having a predetermined condensation temperature and a predetermined decomposition temperature, with the temperature of the c... |
22.09.1984 |
| 18 | JP59168707A |
DELAY CIRCUIT
PURPOSE:To give a delay to an FM modulating signal for a desired time easily by delaying a frequency of an input FM modulating signal by several tens - several hundreds times of the period of the input FM modulating signal through a delay line after frequency-dividing the frequency by 1/N and passing the delayed signal through an N-multiplier. CONSTITUTION:An FM modulating signal is converted into... |
22.09.1984 |
| 19 | JP59168647A |
WIRE BONDING DEVICE
PURPOSE:To bring a bonding arm into contact with and make it follow to the outer circumference of a cam by predetermined push force, to move a capillary smoothly and vertically and to ensure positive wire bonding with high reliability by pushing the bonding arm to and bringing it into contact with the outer circumference of the cam by a hydropneumatic cylinder. CONSTITUTION:When turning a driving ... |
22.09.1984 |
| 20 | JP59168646A |
DETECTING METHOD OF POSITION OF SEMICONDUCTOR PELLET
PURPOSE:To detect detection displacement to X-Y axes positively even in a rectangular semiconductor pellet, and to ensure wire bonding causing no positional displacement by setting up positioning points at three corner sections in a semiconductor pellet and detecting the position of the pellet. CONSTITUTION:Each electrode 4 and patterns 5, 6, 7 at three corner sections are formed on the upper surf... |
22.09.1984 |