A biaxially oriented polyester film containing 0.01 to 4 wt% of multilayered high-molecular particles having a weight-average particle size of 0.05 to 3 mu m which comprise core crosslinked high-molecular particles having a glass transition temperature of not lower than 100 DEG C coated with a crosslinked polymer having a glass transition temperature of lower than 100 DEG C, the ratio Dw/Dn of th...

A biaxially oriented polyester film containing 0.01 to 4 wt%, based on the polyester film, of inorganic particles, the volumetric shape parameter being 0.02 to 0.20, the weight-average particle size being 0.05 to 3 mu m, and the ratio (Dw/Dn) of the weight-average particle size (Dw) and the number-average particle size (Dn) being not more than 1.10 is disclosed. The film of the present invention ...

A chip carrier is disclosed which includes a chip carrier substrate and at least one semiconductor chip mounted in a flip chip configuration, via solder balls, on a circuitized surface of the chip carrier substrate. The solder balls are encapsulated in a first encapsulant having a composition which includes an epoxy. In addition, at least a portion of the circuitry on the circuitized surface is en...

A remote control unit (30) for use with an in-home audio player adapted to play pre-recorded music stored on a semiconductor music chip storage medium is, in a preferred embodiment, a battery powered, hand held device which enables customized music selections to be made at the audio player from a distant position. The remote control unit includes an LCD display (40), a series of control buttons (4...

A sidewall actuated channel array for a high density ink jet printhead. The sidewall actuator (28) includes a top wall (16), a bottom wall (12) and at least one elongated liquid confining channel (18) defined by the top wall (16), the bottom wall (12) and sidewalls (30,32). The actuator sidewall is comprised of a first actuator sidewall section (32) formed of a piezoelectric material poled in a fi...

Method for manufacturing a sidewall actuatable, high density channel array for an ink jet printhead. A first surface of a main body portion formed from an inactive material is conductively bonded to a first surface of a first intermediate body portion formed from an active material. A plurality of parallel grooves are then machined through the first intermediate body portion and part of the main b...

A motor control circuit for a wire bonding apparatus for manufacturing semiconductor devices, etc. using a feedback gain circuit which performs feedback control of a synthesized signal that drives a Z-axis motor for moving a capillary up and down. The gain value of the feedback gain circuit is controlled by a computer, thus allowing smooth and stable control of the motor operation even after rotat...

The invention relates to a catheter comprising a tubular basic body with a distal and a proximal end. A balloon member is arranged on the distal end. Close to the balloon member is further arranged an elastic balloon protection sheath which can be pulled over the balloon with at least one pull thread connected to the end facing toward the balloon and extending to the proximal end.

An article is coated with a multilayer coating comprising a nickel layer deposited on the surface of the article, a tin-nickel alloy layer deposited on the nickel layer, and a refractory metal compound, preferably zirconium nitride, deposited on the tin-nickel alloy layer. The coating provides the color of polished brass to the article and also provides abrasion and corrosion protection.

An article is coated with a multilayer coating comprising a tin-nickel alloy layer deposited on the surface of the article, and a refractory metal compound, preferably zirconium nitride, deposited on the tin-nickel layer. The coating provides the color of polished brass to the article and also provides abrasion and wear protection.

A die bonding apparatus for bonding a semiconductor die onto a boding surface of a semiconductor lead frame by pressing the semiconductor die under a constant pressure. The apparatus includes a mounting section for mounting the semiconductor die a collet having chucking portion for holding the semiconductor die mounted on the die mounting section, a linear motor for moving the collet up and down, ...

A pressure equalization device connects to a port on an endoscope and equalizes the pressure within the endoscope to an environment thereabout. An outlet check valve allows flow out of the port and blocks flow into the port. A filter may be provided for preventing known chemical agents from entering the port. If the agent is hydrogen peroxide, the filter preferably comprises a catalyst, such as co...

The present invention provides admixtures and methods for PCR amplification of a target nucleic acid in which amplification efficiency is increased by including phosphorothioated oligonucleotide primers and an exonuclease in the PCR reaction mix. Kits for amplification of a target nucleic acid are also provided.

A magnetoresistive (MR) sensor is disclosed which comprises a first and a second thin film layer of a magnetic material separated by a thin film layer of a non-magnetic metallic material. The first ferromagnetic layer is magnetically soft. The magnetization direction of the first layer of magnetic material is set substantially perpendicular to the magnetization of the second layer of magnetic mate...

The present invention relates to a reusable fixture for a carrier tape for holding a carrier tape of the TCP type. It is an object of the present invention to provide a reusable fixture which allows a carrier tape to be mounted thereon using an apparatus of a simple structure, which allows the carrier tape to be held securely, and in which powder produced by friction is not produced when the carri...

A wire bonding method used in a bonding apparatus manufacturing, for example, semiconductor devices makes a correction of the ultrasonic output of a transducer using one of three correction timing patterns: a first correction timing pattern which makes the ultrasonic output correction prior to a first bonding by a first bonding wire to a single IC device, a second correction timing pattern which m...

A self-loading controlled deflection roll (6) has its tubular shell (52) rotatably supported on front and back bearings (42) which, in turn, are mounted on a bearing ring (12) which is outwardly-movable arcuately on a pair of opposed pistons (24, 26) and shoes (28, 30) at either end of the roll. The bearing ring (12) at each end of the roll is pivotally linked with the roll shaft (10) to prevent s...

A rail section (2) longer than the wheelbase of a conveyor carriage is hingedly connected to on one side (8) to a fixed carrier device (12). The other side (22) can move freely and is supported on a spring device (27) having an indicating and/or switching device (48). It is thus possible to prevent an overloaded conveyor carriage from running and hence to prevent damage to or breakdowns in a small...

A protocol (20) for labeling various types of data contained in a music chip includes a hierarchical arrangement of headers (22, 34) for storing information about selections on the chip and the method in which they were coded in the memory of the chip. A global header (22) located at the very start of memory will specify information needed to successfully decode the content of the music chip. This...