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1 JP2001354691A
METHOD FOR PRODUCING PURIFIED N-ACETYLLACTOSAMINE

PROBLEM TO BE SOLVED: To provide a method for purifying N-acetyllactosamine from a solution containing N-acetyllactosamine and N-acetylallolactosamine simply and inexpensively and capable of being used in an industrial scale. SOLUTION: This method for purifying N-acetyllactosamine from a mixture containing N-acetyllactosamine and N-acetylallolactosamine is characterized by treating the above mixtu...

25.12.2001
2 JP2001354805A
TIRE PROVIDED WITH CONSTITUENT ELEMENT COMPOSED OF RUBBER COMPOSITION CONTAINING PRE-HYDROPHOBATED SILICA AGGREGATE

PROBLEM TO BE SOLVED: To obtain a tire having a constituent element composed of a rubber composition containing a pre-hydrophobated precipitated silica aggregate of a raw silica particle by treating a colloidal silica with both an organomercaptosilane and an alkylsilane. SOLUTION: This tire comprises at least one constituent element composed of a rubber composition containing a pre-hydrophobated p...

25.12.2001
3 JP2001354890A
INK SET FOR INKJET PRINTING

PROBLEM TO BE SOLVED: To provide an improved inkjet product capable of satisfying durability and chroma target, and capable of providing satisfaction to a consumer in an inkjet printing. SOLUTION: This invention relates to a polyvinyl alcohol additive useful for an inkjet printing system including the fifth and sixth pen sets. The fluid in the invention profitably interacts with one of a medium, a...

25.12.2001
4 JP2001354902A
COATING COMPOSITION AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To obtain a coating composition which is excellent in dispersibility of a photocatalyst and preservation stability and gives a coating film excellent in durability and adhesion and exhibiting photocatalytic functions. SOLUTION: The coating composition comprises (a) at least one selected from organosilanes represented by the formula: (R1)nSi(OR2)4-n (wherein R1 is same or diff...

25.12.2001
5 JP2001354945A
NEAR-INFRARED-RAY-ABSORBING COMPOSITION AND OPTICAL MATERIAL

PROBLEM TO BE SOLVED: To obtain a near-infrared-ray-absorbing composition and an optical material both having excellent near-infrared-ray-absorbing characteristics and exhibiting visible ray transmission characteristics better than those of conventional ones. SOLUTION: This composition contains copper ion and a phosphoric ester represented by formula 1, e.g. formula 7-b, (wherein R denotes an aryl...

25.12.2001
6 JP3242680B2
<назва відсутня>

Dust-free investment materials for producing precision castings consisting of water-soluble phosphates, magnesium oxide and silicon dioxide are obtained when the investment material is divided into two components a and b, where component a contains all the magnesium oxide, where appropriate a part of the silicon dioxide and, if silicon dioxide is present, 0.4 to 6% by weight of a hydrophilic organ...

25.12.2001
7 CA2133501C
ANALYZING AN IMAGE SHOWING A GRAPHICAL REPRESENTATION OF A LAYOUT;ANALYSE D'IMAGES DE REPRESENTATION GRAPHIQUE DE CONFIGURATIONS

Input image data define an input image set that shows a graphical representation of a layout with two or more segments. The graphical representation can be a sketch, and can include, for example, a rectangular boundary with lines parallel to its sides defining rectangular segments within the boundary. The input image data are used to obtain segment source data indicating a source for each segment ...

25.12.2001
8 US6333563B1
ELECTRICAL INTERCONNECTION PACKAGE AND METHOD THEREOF

The present invention relates generally to an electrical interconnection package and a method thereof. More particularly, the invention encompasses an invention that increases the fatigue life of a Ball Grid Array (BGA) electrical interconnection. This invention structurally couples at least one module to an organic interposer using a high modulus underfill material. The organic interposer is then...

25.12.2001
9 US6333857B1
PRINTING WIRING BOARD, CORE SUBSTRATE, AND METHOD FOR FABRICATING THE CORE SUBSTRATE

A printed wiring board includes a core substrate including a laminated capacitor. The laminated capacitor includes a plurality of composite dielectric layers and a plurality of metal layers stacked alternately. Three types through-hole conductors are provided which extend between the upper and lower surfaces of the core substrate. The first through-hole conductors are directly connected to first m...

25.12.2001
10 US6334192B1
COMPUTER SYSTEM AND METHOD FOR A SELF ADMINISTERED RISK ASSESSMENT

A computer system for performing an interactive assessment of the risk of an event, has a computer monitor to present to a user of the system a series of questions and potential responses, and a keyboard or other device to select a response to the question. The system can administer complex inverted tree type decision algorithms, in which the questions that are presented to the user, depend upon t...

25.12.2001
11 US6332675B1
INK CONTAINER, INK AND INK JET RECORDING APPARATUS USING INK CONTAINER

A liquid container for a liquid jet recording apparatus comprises a first chamber containing negative pressure producing material and having a liquid outlet connectable to a liquid jet head to supply liquid from the container to the liquid jet head and an air vent for allowing ambient air into the container, wherein the liquid outlet is provided in a bottom portion of the first chamber. A second c...

25.12.2001
12 US6332702B1
HEADLIGHT FOR VEHICLE FOR LOW BEAM AND AT LEAST ONE FURTHER LIGHT FUNCTION

A headlight for a vehicle for producing low beam light and at least one further light function has a reflector, at least one light source, an adjusting device which moves the light source relative to the reflector between a position for a light function of low beam and at least one further position for at least one further light function, the adjusting device being arranged at a rear side of the r...

25.12.2001
13 US6332766B1
APPARATUS FOR ENCASING ARRAY PACKAGES

The upper and lower mold plates of a transfer molding machine are configured for one-side encapsulation of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipator. The pair of devices is positioned back-to-back within a single mold cavity for simultaneous encapsulation. A buffer member, optionally with cut-outs or apertures, may be pl...

25.12.2001
14 US6333037B1
METHODS FOR TREATING PAIN WITH A MODIFIED NEUROTOXIN

Methods for treating pain by intrathecal administration to a human patient of a therapeutically effective amount of a neurotoxin such as botulinum toxin type A are disclosed.

25.12.2001
15 US6333188B1
LACTIC ACID BACTERIA PREPARATION HAVING BIOPURIFICATION ACTIVITY

Although the inventors previously found that the novel species designated Lactobacillus clearans was highly effective for health purposes, they noted in particular that this species lacked sufficient intestinal purification action. Efforts to produce a species of higher potency and the like to remedy this drawback led to the unavoidable conclusion that the use of a bacterium by itself produced lim...

25.12.2001
16 US6333460B1
STRUCTURAL SUPPORT FOR DIRECT LID ATTACH

An electronic chip assembly having the following components:a substrate having electrical conductors therein;an electronic circuit chip affixed face down to the substrate so as to make electrical connection to the conductors;a male framing member, compliantly adhered to the substrate;a lid having a female channel, the channel having sidewalls, the channel being disposed on or within said lid for r...

25.12.2001
17 US6333527B2
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

A semiconductor device comprising a dual polysilicon gate structure in which the P type polysilicon gate is connected with the N type polysilicon gate by a bilayer conductive wiring structure without any contact, thereby significantly contributing to high integration, and a method for fabricating the semiconductor device such that the production yield is improved.

25.12.2001
18 US6333555B1
INTERCONNECT FOR SEMICONDUCTOR COMPONENTS AND METHOD OF FABRICATION

An interconnect for electrically contacting semiconductor components such as bare dice, wafers and chip scale packages, is provided. The interconnect includes a rigid substrate and polymer contact members formed on the substrate. The polymer contact members are adapted to electrically engage contacts (e.g., bond pads, solder bumps) on the component. In one embodiment the polymer contact members ar...

25.12.2001
19 JP2001352813A
CROP HARVESTER

PROBLEM TO BE SOLVED: To supply root crops such as sweet potato, potato and konjak root harvested from a field to a digging conveyor preventing the drop of the crop on the field. SOLUTION: A digging conveyor 6 for digging and transporting crops on a field is extended from the lower front part of a traveling body 2 through the upper part of the middle of the body to the rear part of the body. A pai...

25.12.2001
20 JP2001352814A
ROOT VEGETABLE HARVESTER

PROBLEM TO BE SOLVED: To harvest root vegetables in a field even in the case of carrots and radishes. SOLUTION: This root vegetable harvester is equipped with a stem and leaf cutting means 44 for cutting the stem and leaf part of the root vegetable in the vicinity of the rear end part of a pair of right and left nipping endless belts 3 and 3 for nipping the stem and leaf part of the root vegetable...

25.12.2001